Fabrication and Characterization of Micro Connector for High Density Packaging Using UV Thick Photoresist

Abstract

This study describes a micro connector produced using UV thick resist, lithography, and electroforming, and its evaluation. The fabricated connector has 100 pins with 80pm pitch. The terminals of the fabricated micro connector were 50μm thick and 15μm wide (minimum) . The maximum aspect ratio of the fabricated micro connector is 3.3 and the terminal pitch is 80μm. In evaluating its specific properties, contact force, contact resistance, Young's modulus and permissible current have been determined. The contact force is 3.3 mN at 5μm displacement of the socket terminal. The contact resistance among terminals is shown to be less than 50 mΩ using a four-point probe method. Young's modulus of he Ni structure is found to be 180 GPa using the SPM method. The designed connector treated by Au plating has indicated the possibility of obtaining stable electric contact after the durability test.