Abstract
Composite films composed of various polyimides derived from decamethylene bis (trimellitate) anhydride (DBTA), an epoxy resin and a silver filler were prepared and their properties were studied. The films showed thermoplastic behavior before curing with molten performance at high temperatures above their Tgs, and thermosetting behavior after curing with restricted flow behavior even above their Tgs. The limited flow behavior results from the network structure formation in the film. The adhesion strength of the film when used as an adhesive film between two adherents having different thermal strains was affected by two main factors: the modulus and stress relaxation property of the film. In this paper, the relationship between the chemical structure of the polyimides and the various properties of the composite films is discussed.
