Electrochemical Monitoring Method for Filling Capability of Copper Electroplating Solution for Via Filling

Abstract

We have developed a method to monitor the time-dependent change in the filling capability of a via-hole filling copper electroplating solution. In this method, a rotating disk electrode is used to produce a controlled solution flow, and a constant current is applied to the rotating electrode in order to measure the potential value which is necessary to judge the filling capability. The obtained time-potential curves could be approximately fitted to a Boltzmann function to acquire the quantitative parameters required for judging the filling capability.