Abstract
In order to achieve the accurate interconnect design and manufacturing, we have adopted the following two approaches: accurate interconnect modeling using the RLGC model with skin effect considerations, and development of a low-k and low-loss resin featuring fine adhesion strength with Cu interconnects through the removal of the weak boundary layer. The experimental results revealed that the RLGC model with skin effect consideration showed good agreement with the measurement results of microstrip lines over a wide frequency range. The developed low-k (εr=2.75) and low-loss (tan δ=0.0099) resin does not require a rough anchoring surface, resulting in the reduction of metal and dielectric losses. The signal propagation loss is reduced to 0.37 dB/cm at 10 GHz with 50 Ω microstrip lines (line width=88μm, line thickness =15μm) on a 37μm thick resin with fine plated-Cu adhesion (9.2 N/cm) . These technologies will be indispensable for both the accurate modeling of interconnects and high signal integrity in the coming generation of electronics.
