The corrosion behavior of a commercial Ag-Pd-Cu-Au alloy in O.9% NaCl solution was investigated by an electrochemical technique, surface analysis of X-ray photoelectron spectroscopy and reflection electron diffraction.
No corrosion of the alloy examined was observed at negative potentials of -100mV or less.
In the potential region from 0 mV to +300mV, the alloy may be oxidized to form surface films of AgCl, AgO, Cu
2O, CuO, Cu(OH)Cl, CuO and CuCl
2 on the basis of the equilibrium potential for this system.
Pd in the alloy was oxidized to form PdO
2 at +400mV and at +500mV. AgCl and Cu(OH)
2 were found on the sample surface anodized at +400mV and +500mV. The amount of AgCl was greater than that of Cu(OH)
2.
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