Continuing on from part one, this article describes different fabrication processes of Nb
3Sn wires. The PIT process using Nb-Sn compound powder, Ta-Sn powder and Cu
5Sn
4 powder has been commercialized. The Nb tube process, originally developed in Japan, has been recently revived in US. A MJR process using Nb mesh sheet has been also developed. The Nb
3Sn wires fabricated through these processes show nearly the same high non-Cu
Jc at 12 T as that of the RRP internal Sn processed wire described in the last article. The JR Nb
3Sn wires using Sn-based alloy sheet indicate enough potential to be used in fields over 20 T at 4.2 K. The stoichiometric Sn concentration and the homogeneous grain structure are the key factors to produce high performance in the Nb
3Sn layers. In addition Nb
3Sn wires with ultra-thin filaments have been developed for AC use. In the study of V
3Ga wires, pioneering works have been performed, such as the effect of Cu for the synthesis of A15 layer, which yielded a breakthrough in the wire fabrication. The V
3Ga wires have also been used for high-field superconducting magnets. Further progress may be expected in the processing and performance of these compound wires based on the informations obtained so far.
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