Highly efficient cutting can be achieved by applying ″scribe + break″technology used for cutting flat glass typified by liquid crystal panels to cutting materials for electronic parts. However, many scribing phenomena have not yet been elucidated. In this study, we investigated the crack extension behavior of alumina, single-crystal Si, single-crystal SiC used as electronic component materials during scribing in comparison with glass. The arrest line of 1st Crack and 2nd Crack were confirmed in alumina and single-crystal Si like glass, but only the arrest line of 1st Crack was confirmed in the case of single-crystal SiC.

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