巻号一覧
34 巻 (2000)
- 77 号 p. 1-
- 76 号 p. 8-
- 75 号 p. 6-
34 巻, 75 号
選択された号の論文の5件中1～5を表示しています
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横井 秀俊2000 年 34 巻 75 号 p. 6-13
発行日: 2000/03/30
公開日: 2010/03/12
ジャーナル フリーPDF形式でダウンロード (11029K) -
岡田 晃, 宇野 義幸, 岡本 康寛, 伊藤 久, 平野 爲義2000 年 34 巻 75 号 p. 14-21
発行日: 2000/03/30
公開日: 2010/03/12
ジャーナル フリーMonocrystalline silicon is one of the most important materials in the semiconductor industry because of its many excellent properties as a semiconductor. In the manufacturing process of silicon wafers, inner diameter (ID) blade and multi wire saw have conventionally been used for slicing silicon ingots. However, some problems in efficiency, accuracy, slurry treatment and contamination are experienced when applying this method to largescale wafers of 12 or 16 inch diameter expected to be used in the near future. Thus, the improvement of conventional methods or a new slicing method is strongly required. In this study, the possibility of slicing a silicon ingot by wire EDM was discussed and the machining properties were experimentally investigated. A silicon wafer used as substratum for epitaxial film growth has low resistivity in the order of 0.01Ω·cm, which makes it possible to cut silicon ingots by wire EDM. It was clarified that the new wire EDM has potential for application as a new slicing method, and that the surface roughness using this method is as small as that using the conventional multi wire saw method. Moreover, it was pointed out that the contamination due to the adhesion and diffusion of wire electrode material into the machined surface can be reduced by wire EDM under the condition of low current and long discharge duration.抄録全体を表示PDF形式でダウンロード (4868K) -
薩田 寿隆, 平井 清人, 吉澤 宗晴2000 年 34 巻 75 号 p. 22-29
発行日: 2000/03/30
公開日: 2010/03/12
ジャーナル フリーIn this study, EDM with a powder suspended dielectric has been applied in order to improve the surface quality of workpieces. WC (tungsten carbide) as a suspended powder and DC53 (die steel for cold working) as workpieces were both adopted. Just after the WC powder was suspended into the dielectric, the surface of the workpiece was not modified but machined. As the discharge time for modification was accumulated, the surface became modified. After confirming that the surface was modified with the WC powder suspended dielectric, the effects of the discharge time per treatment on the characteristics of the modified layers were investigated. The longer the discharge time per treatment was, the harder the surface of the improved layer became. This is due to the increase of the produced amount of WC1-x. Ohgoshi wearing-out test was performed to evaluate the wear resistance of the improved layers. It revealed that the worn volume of the improved layer was decreased maximally by about 10% as compared to that of the base steel.抄録全体を表示PDF形式でダウンロード (4564K) -
仕上げ加工の加工精度の検討小原 治樹, 石津 稔之, 河合 保, 大住 剛, 林 卓郎2000 年 34 巻 75 号 p. 30-37
発行日: 2000/03/30
公開日: 2010/03/12
ジャーナル フリーIn the present study, the accuracy of the finish cut for Wire EDM is analytically and experimentally investigated. In order to simulate the finish cut, the explosive force, electrostatic force and electromagnetic force are estimated based on the wire deflection. The simulated wire deflection on the finish cut is compared to the measured value. Problems associated with the finish cut that were revealed by the simulated results are described. The effect of electrostatic force on the cut wall straightness and countermeasures to prevent this effect on the finish cut are described. The results of the present study are as follows; 1) the explosive force of the finish cut decreased to 30-60% of the rough cut, depending on the skimmed depth, 2) the dielectric constant of the water in the gap decreases to 20-30% of the nominal value during the finish cutting, 3) the electrostatic force may cause irregular wire movement, and for thick work pieces may overcut at the corners, 4) the electrostatic force results in concave cut walls, and 5) the finish cutting in air is useful for decreasing the electrostatic force and obtaining good wall straightness.抄録全体を表示PDF形式でダウンロード (972K) -
後藤 昭弘, 毛呂 俊夫, 松川 公映2000 年 34 巻 75 号 p. 38-43
発行日: 2000/03/30
公開日: 2010/03/12
ジャーナル フリーPDF形式でダウンロード (10907K)
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