巻号一覧
48 巻 (2014)
- 119 号 p. 171-
- 118 号 p. 100-
- 117 号 p. 6-
48 巻, 118 号
選択された号の論文の3件中1～3を表示しています
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研究
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－放電条件による表面磁束密度の変化と磁石内部温度の関係－武沢 英樹, 市村 佳大, 毛利 尚武原稿種別: 研究
2014 年 48 巻 118 号 p. 100-107
発行日: 2014年
公開日: 2015/05/25
ジャーナル フリーIt is difficult to perform traditional machining of a permanent magnet, which is a functional material, because of its brittleness and magnetic forces. However, electrical discharge machining (EDM), which is a noncontact machining method, has been used for shape machining of magnetic materials. Magnetic materials have a Curie point; therefore, their magnetic flux density decreases when they are heated to a high temperature. Because EDM is a thermal process, it has the potential to control the magnetic flux density of a machined surface. In this study, to clarify the influence of magnetic flux density on a machined surface, the following machining conditions were investigated: the Duty Factor (D.F.) and internal temperature. The results showed that the influence of the magnetic flux density was small under low-energy machining conditions. In contrast, under high-energy machining conditions or a high D.F., the magnetic flux density significantly decreased compared with the initial value. These results have confirmed the importance of machining conditions for EDM of magnetic materials.抄録全体を表示PDF形式でダウンロード (1178K) -
佐藤 達志, 佐藤 清侍, 三宅 英孝, 服部 広一郎, 戸倉 和原稿種別: 研究
2014 年 48 巻 118 号 p. 108-117
発行日: 2014年
公開日: 2015/05/25
ジャーナル フリーWire-break, which greatly harms machining performance, can be prevented by reducing the ma- chining energy. However, too much reducing the energy also harms machining speed. Thus control algorithm which brings minimum requirement for wire-break prevention is needed. In this paper, we clarify there exists energy limit that brings wire-break, and the limit changes according to two factors: the workpiece thickness and the flow of dielectric fluid. In addition, we propose the control algorithm for wire-break prevention, which detect these two factors automatically. It is also shown that this control algorithm brings much higher performance when these two factor change during machining.抄録全体を表示PDF形式でダウンロード (991K) -
佐藤 達志, 松野 繁, 越前谷 大介, 前川 武之, 戸倉 和原稿種別: 研究
2014 年 48 巻 118 号 p. 118-127
発行日: 2014年
公開日: 2015/05/25
ジャーナル フリーA method of slicing solar-grade silicon into thin wafers is greatly demanded because of the rapid increase in the production volume of photovoltaic cells. Wire electrical discharge machining seems to be a suitable slicing method because it is a noncontact process that hardly cracks wafers. However, solar-grade silicon is not so highly conductive that it is difficult to slice it by wire electrical discharge machining. In this paper, we propose a new machining power supply suitable for slicing solar-grade silicon, which causes minimum damage to the machined surface. We also show that photovoltaic cells made from the wafers sliced by wire electrical dischage machining are comparable to conventional cells. We conclude that wire electrical discharge machining can be one of the practical methods of slicing solar-grade silicon.抄録全体を表示PDF形式でダウンロード (3200K)
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