Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Materials & Process Technologies
High Heat-Resistant, Low Dielectric Multi-layer Circuit Board Materials
Masao ImaiHiroyuki FujisawaHiroki TamiyaTatsuo Yonemoto
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2010 Volume 13 Issue 5 Pages 363-366

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© 2010 The Japan Institute of Electronics Packaging
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