Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Materials & Process Technologies
New Low-CTE and High-Modulus Materials for Next Generation Application
Shin Takanezawa, Hikari Murai, Masato Miyatake, Tomohiko Kotake, Masaaki Takekoshi, Taro Momozaki, Tetsuro Irino, Koji Morita
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2010 Volume 13 Issue 5 Pages 367-370

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HYBRIDS

Circuit Technology

Journal of SHM

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Transactions of The Japan Institute of Electronics Packaging
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