Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / The Current and Future Prospect in Three Dimensional Packaging
3D-LSI Development Trend, and Novel Packaging Technology for SiP
Kazuyuki Mizushima
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2012 Volume 15 Issue 2 Pages 132-135

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