Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
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Volume 15, Issue 2
Displaying 1-14 of 14 articles from this issue
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Preface
Special Articles / The Current and Future Prospect in Three Dimensional Packaging
Technical Paper
  • Development of Bi-Based Pb-Free Solders for High-Temperature
    Takashi Iseki, Masato Takamori
    Article type: Technical Paper
    2012 Volume 15 Issue 2 Pages 153-157
    Published: March 01, 2012
    Released on J-STAGE: August 28, 2012
    DOIhttps://doi.org/10.5104/jiep.15.153
    JOURNAL FREE ACCESS
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    Bi-based alloys were investigated for their potential to replace Pb-based solders for high-temperature applications. It is found that Bi–Ag, Bi–Sn and Bi–Zn alloys improve the mechanical properties of the solder, especially Bi–Zn alloy, which shows good workability for wire extrusion. In addition, Bi–Zn alloy has good wettability on Ag-plated substrates and prevents the surplus Bi–Ni reaction in the soldering process. As a result, Bi–Zn alloys with a solidus temperature of 255C are proposed as Pb-free solders for high-temperature applications.
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