Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / The Current and Future Prospect in Three Dimensional Packaging
Consideration for Main Application Constructed by 3D-TSV Technology
Kanji Otsuka
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2012 Volume 15 Issue 2 Pages 136-141

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