Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / The Current and Future Prospect in Three Dimensional Packaging
Structure Analysis and Thermal Analysis for Future Packaging
Keiji Matsumoto, Keishi Okamoto, Sayuri Kohara, Yasumitsu Orii
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2012 Volume 15 Issue 2 Pages 142-147

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Circuit Technology

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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