Development of Printed Wiring Board Technologies for the K Computer

Abstract

The K computer ranked first on the TOP500 List of June 2011. The achievement of such high performance is due not only to the high-performance CPUs but also largely to the system packaging technologies: rack technology to allow high-density mounting of the CPUs, connection technology to achieve high-speed data transmission between the CPUs, and cooling technology for improved reliability. This paper describes the printed wiring board technologies applied to the K computer.