Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Materials and Designing
Dielectric Materials for the Device Embedded Substrate
Eiichi HayashiMasanori Ohkoshi
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2014 Volume 17 Issue 5 Pages 398-403

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© 2014 The Japan Institute of Electronics Packaging
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