Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Heterogeneous Integration
Latest Trend of Electronics Packaging Technology for Printed Circuit Board with Integrated Devices
Takaaki Domon
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2017 Volume 20 Issue 6 Pages 407-412

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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