Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Heterogeneous Integration
The Heterogeneous Integration Package which Supports IoT Era—2.5D/2.1D SiP and Fan Out-Wafer Level Package—
Hiroshi Ozaki
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2017 Volume 20 Issue 6 Pages 413-417

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