Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Trends in Thermal Management of Electronics in Japan
Standards for Heat Dissipation of Printed Circuit Boards by JPCA
Tomoyuki Hatakeyama
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2018 Volume 21 Issue 2 Pages 126-129

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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