Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Trends in Thermal Management of Electronics in Japan
Trend of Standardization of Thermal Management Corresponding to Changes in Mounting and Heat Dissipation Path
Takashi Fukue, Koichi Hirasawa, Masahiro Uchida, Yuji Okada, Tetsuya Hiraiwa
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2018 Volume 21 Issue 2 Pages 130-136

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Circuit Technology

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Transactions of The Japan Institute of Electronics Packaging
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