Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Volume 21, Issue 2
Displaying 1-20 of 20 articles from this issue
Preface
Special Articles / Trends in Thermal Management of Electronics in Japan
Technical Paper
  • Hiroyuki Nakamura, Yasunori Yoshida, Konami Izumi, Daisuke Kumaki, Shi ...
    2018 Volume 21 Issue 2 Pages 137-142
    Published: 2018
    Released on J-STAGE: March 01, 2018
    JOURNAL FREE ACCESS
    We have developed a new printing technology called “Soft Blanket Gravure (SBG)” printing, which is able to print patterns onto curved or three-dimensional object surfaces using a thick and soft offset blanket (called a “soft blanket”). We have found that SBG printing can print silver inks under various conditions where conventional gravure offset printing cannot typically print. In particular, SBG printing can print wide interconnects with widths of several millimeters. We have also succeeded in simultaneously printing interconnects that have widths of 50-1,000 micrometers on a glass substrate.
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  • Ken Kawamura, Hidenori Murata, Takeshi Sakamoto, Ryohei Satoh, Yoshiha ...
    2018 Volume 21 Issue 2 Pages 143-154
    Published: 2018
    Released on J-STAGE: March 01, 2018
    JOURNAL FREE ACCESS
    In the design of product systems that support the IoT society, more efficient system designs are required. Therefore, the optimization design method SDSI-Cubic has been studied. However, it has become clear that it is difficult to reuse the system model if the requirements are changed. In this paper, a new modeling methodology for system design is examined. It is discovered that the information for system designs can be separated into 4 components: product system, design space, design algorithm, and design environment. By modeling these components, the reusability of system models and the cooperation of various design tools are improved. Furthermore, the new modeling methodology is applied to a radiation measurement system which was designed using the SDSI-Cubic method. As the result, the reusability of the system model is confirmed in this applied case and the possibility of efficient design is clarified.
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  • Hiroki Seto, Kei Hashizume, Toshiya Murata
    2018 Volume 21 Issue 2 Pages 155-159
    Published: 2018
    Released on J-STAGE: March 01, 2018
    JOURNAL FREE ACCESS
    Compact electronic devices are created primarily using fine patterning technology. Electroless Ni-P/Au plating plays an important role in the metal finishing for these printed circuit boards. In this study, we evaluated new additives containing high-valent metal ions for electroless nickel plating to improve pattern forming. Conventional additives have caused step plating or poor corrosion resistance. But the addition of high-valent metal ions could prevent these problems. Also, our research indicates that the addition of trivalent cobalt ions could most effectively prevent deposition outside of the patterns. We suppose that cobalt reduction from trivalent to bivalent happens on palladium residues preferentially to the deposition of nickel. Therefore, deposition outside of the patterns can be prevented by the addition of trivalent cobalt ions.
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  • Katsuyoshi Sakaime, Kenta Arai, Shiro Aono, Ryo Nagase
    2018 Volume 21 Issue 2 Pages 160-165
    Published: 2018
    Released on J-STAGE: March 01, 2018
    JOURNAL FREE ACCESS
    Split sleeves are essential for fiber-optic connectors. The microscopic deformation of a split sleeve in which two ferrules are inserted generates a gauge retention force related to connector performance. However, Finite Element Method (FEM) analyses of split sleeves was difficult because of their very small deformation and lack of a fixing point between ferrule and sleeve. This paper describes the microscopic deformation of a split sleeve using FEM analysis, which is confirmed by measuring the split width, the split sleeve surface strain using strain gauges, and the attenuation of Angled PC connectors, which varies according to the ferrule endface angle and split sleeve direction.
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  • Tatsujiro Miyazaki, Nao-Aki Noda, Yoshikazu Sano
    2018 Volume 21 Issue 2 Pages 166-177
    Published: 2018
    Released on J-STAGE: March 01, 2018
    JOURNAL FREE ACCESS
    In this paper, a precise and efficient method is proposed for the analysis of the intensity of the singular stress field (ISSF) for single lap joints (SLJs). The analysis method focuses on the FEM stress value at the interface end by applying the same FEM mesh pattern to the unknown and reference models. Previous analysis showed that accurate ISSFs can be obtained for butt joints mesh-independently. In this paper, we analyze SLJs having two distinct singular stress fields by separating the FEM stress into two values corresponding to the two ISSFs. We confirm that our method can provide the ISSFs accurately and efficiently even for the difficult cases when the singular index is nearly equal to 1.
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  • Tohlu Matsushima, Tetsushi Watanabe, Yoshitaka Toyota, Liuji R. Koga, ...
    2018 Volume 21 Issue 2 Pages 178-185
    Published: 2018
    Released on J-STAGE: March 01, 2018
    JOURNAL FREE ACCESS
    The electric asymmetry of a pair of differential transmission lines placed near an adjacent ground edge causes unwanted electromagnetic radiation when the adjacent ground width changes. In this paper, the imbalance difference model which has been proposed by the authors is verified by experiment and full-wave simulation for asymmetric differential transmission lines at different distances from the adjacent ground edge. The difference in secondary-common mode current in terms of the distance from the ground edge coincides with an error of up to 3 dB among the imbalance difference model, measurement, and electromagnetic simulation. Therefore the imbalance difference model has sufficient accuracy for practical use in designing differential transmission lines which produce less undesired emissions.
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