Probes for Very Small Pitch Bump Arrays Using a High Resolution 3D Printer

Abstract

Micro bump arrays are used for logic LSIs. Probes for micro bump arrays require good contact, long lifetimes, and low pad damage. Crown-shaped contact probes satisfy these requirements but the fabrication is very difficult. We designed a selective electrodeposition of metal alloys process for the fabrication of the probes and the simulation results showed satisfactory characteristics.

Probe figures are realized using a high-resolution 3D printing technique with 2-photon excitation followed by coating with metal layers. We recognized that high-resolution 3D printing is useful for rapid prototyping of a new probe and is a powerful tool for developing the next generation of polymer probes.