Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Special Articles / Advanced Electronics and Packaging Technology in AIST
Development of SiC Power Module Capable of High-Temperature and High-Speed Operation with Passive Components
Hiroshi Sato
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2019 Volume 22 Issue 6 Pages 523-528

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HYBRIDS

Circuit Technology

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Transactions of The Japan Institute of Electronics Packaging
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