速報論文
プリント配線板のセミアディティブ工程におけるエッチングプロセスの電気的信頼性に与える影響－交流インピーダンスによる解析
2020 年 23 巻 3 号 p. 239-242
詳細
2020 年 23 巻 3 号 p. 239-242
A printed wiring board manufactured using the semi-additive method (SAP) was subjected to a constant voltage application test under constant temperature and humidity, and AC impedance measurement, scanning electron microscope (SEM) and energy dispersive X-ray spectroscopy (EDX) analysises were performed.
From the results of the AC impedance measurement, we found that the printed circuit board has three resistance components.
It is suggested that the resistance components are derived from the insulator of the printed wiring board, the surface state of the wiring, and the chemical reaction that occurs on the wiring.
