Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Component-Embedded Technology with Expanding Application Fields
Merging of Additive Electronics and Low Temperature SMT into a Seamless System
Ryojiro Tominaga
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2023 Volume 26 Issue 7 Pages 657-662

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Circuit Technology

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The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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Transactions of The Japan Institute of Electronics Packaging
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