Journal of The Japan Institute of Electronics Packaging

Volume 26, Issue 7

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Preface

Baseball, Music, and Technology Conference

Takaaki Ishigure

Article type: Preface
2023 Volume 26 Issue 7 Pages P7
Published: November 01, 2023
Released on J-STAGE: November 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.P7

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Component-Embedded Technology with Expanding Application Fields

Introduction to the Special Edition

Koji Ikawa

Article type: Special Articles
2023 Volume 26 Issue 7 Pages 633
Published: November 01, 2023
Released on J-STAGE: November 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.633

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The Device-Embedded Substrate Technology to Implement Heterogeneous Integration

Henry H. Utsunomiya

Article type: Special Articles
2023 Volume 26 Issue 7 Pages 634-643
Published: November 01, 2023
Released on J-STAGE: November 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.634

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Component-Embedded Substrates for High-Speed, Large-Scale System Modules

Shinichi Maeda

Article type: Special Articles
2023 Volume 26 Issue 7 Pages 644-649
Published: November 01, 2023
Released on J-STAGE: November 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.644

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Productization for Heatproof Embedded Substrate with Sn-Sb High Melting Point Solder Attachment

Mitsuaki Toda

Article type: Special Articles
2023 Volume 26 Issue 7 Pages 650-656
Published: November 01, 2023
Released on J-STAGE: November 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.650

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Merging of Additive Electronics and Low Temperature SMT into a Seamless System

Ryojiro Tominaga

Article type: Special Articles
2023 Volume 26 Issue 7 Pages 657-662
Published: November 01, 2023
Released on J-STAGE: November 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.657

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Activities of IS (International Standards) for Device Embedded Substrate (2)

Yoshihisa Katoh

Article type: Special Articles
2023 Volume 26 Issue 7 Pages 663-668
Published: November 01, 2023
Released on J-STAGE: November 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.663

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Tutorial Series - 3D Integration & Packaging Course / (7)

Test Techniques for 3D-ICs

Hiroyuki Yotsuyanagi

Article type: Tutorial Series
2023 Volume 26 Issue 7 Pages 669-674
Published: November 01, 2023
Released on J-STAGE: November 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.669

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Report

Kitamoto Laboratory, Department of Materials Science and Engineering, School of Materials and Chemical Technology, Tokyo Institute of Technology

Yoshitaka Kitamoto

Article type: Report
2023 Volume 26 Issue 7 Pages 675
Published: November 01, 2023
Released on J-STAGE: November 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.675

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Report

Session Summary of MES 2023

Article type: Report
2023 Volume 26 Issue 7 Pages 680-684
Published: November 01, 2023
Released on J-STAGE: November 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.680

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Announcement, Contents, etc.

[title in Japanese]

Article type: Announcement, Contents, etc.
2023 Volume 26 Issue 7 Pages 676
Published: November 01, 2023
Released on J-STAGE: November 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.676

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[title in Japanese]

Article type: Announcement, Contents, etc.
2023 Volume 26 Issue 7 Pages 677-679
Published: November 01, 2023
Released on J-STAGE: November 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.677

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JIEP Mission Fellow

Article type: Announcement, Contents, etc.
2023 Volume 26 Issue 7 Pages 685
Published: November 01, 2023
Released on J-STAGE: November 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.685

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News

Article type: Announcement, Contents, etc.
2023 Volume 26 Issue 7 Pages 686-688
Published: November 01, 2023
Released on J-STAGE: November 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.686

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Announcement

Article type: Announcement, Contents, etc.
2023 Volume 26 Issue 7 Pages A71-
Published: November 01, 2023
Released on J-STAGE: November 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.A71

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Contents

Article type: Announcement, Contents, etc.
2023 Volume 26 Issue 7 Pages C71
Published: November 01, 2023
Released on J-STAGE: November 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.C71

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Contents (in English)

Article type: Announcement, Contents, etc.
2023 Volume 26 Issue 7 Pages C72
Published: November 01, 2023
Released on J-STAGE: November 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.C72

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Instruction for Authors

Article type: Announcement, Contents, etc.
2023 Volume 26 Issue 7 Pages I71-
Published: November 01, 2023
Released on J-STAGE: November 01, 2023

DOIhttps://doi.org/10.5104/jiep.26.I71

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