Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Supporting Advanced Packaging and World-Leading Material Technologies
Highly Dispersible and Low-Temperature Sinterable Submicron Cu Particles
Takaaki Eyama, Shuichi Inaya, Ukyo Suzuki, Taiki Fukuda, Ryo Nakanishi, Masafumi Takesue
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2024 Volume 27 Issue 5 Pages 404-409

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HYBRIDS

Circuit Technology

Journal of SHM

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

Related journals
Transactions of The Japan Institute of Electronics Packaging
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