抄録
Recently 0.5mm pitch FBGA was developed. The FBGA package currently in production is active in memory products with 100 or fewer pins, as well as logic products in the 100-to 300-pin class. It is necessary to use the suitable surface mount technology for fine-pitch CSP. The surface mount technology for fine-pitch BGA is reported here, and the recommended surface mount condition for fine-pitch CSP is proposed.
