Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
Effect of Ground Via Shielding on the Electrical Performance of Via Interconnections Embedded in a Multilayer PCB
Taras KUSHTAKaoru NARITATakanori SAEKIHirokazu TOHYA
Author information

2004 Volume 7 Issue 4 Pages 314-321


In this paper, we present theoretical and experimental studies of the effect of resonant modes excited inside rectangular cavities formed by ground plates and ground via fences of shielding in a multilayer printed circuit board (PCB) on the electrical performance of via transitions at frequencies up to 10GHz. Three types of the transitions, such as single signal via, signal via surrounded by ground vias to form a vertical wave guiding structure and via pairs for differential signaling, embedded within the boundaries of the shielding in the same PCB are considered. Presented results cover reflection, transmission, and crosstalk phenomena in these types of via transitions under the effect of the cavity modes. As an outcome, some ways to develop interconnect circuits including via transitions embedded in multilayer PCBs at higher frequencies are traced here.

Information related to the author
© The Japan Institute of Electronics Packaging
Previous article Next article