Journal of the Japan Society for Abrasive Technology
Online ISSN : 1880-7534
Print ISSN : 0914-2703
ISSN-L : 0914-2703
Volume 59, Issue 2
Displaying 1-3 of 3 articles from this issue
  • 1st report : polishing for silicon wafer
    Shinsaku HAGIWARA, Terunobu KUJI, Tsuyoshi SHIMIZU, Yuzairi ABDUL RAHI ...
    2015 Volume 59 Issue 2 Pages 75-80
    Published: February 01, 2015
    Released on J-STAGE: May 02, 2015
    JOURNAL FREE ACCESS
    Grain processing using a charcoal polisher is explored and developed based on natural resources. The proposal is to develop a charcoal polisher and apply it to several areas, such polish processing of semiconductor silicon wafers. Although charcoal can be ground easily, thus facilitating refining, crushing tends to become difficult due to the scale effect. Even with repeated crushing to generate fine particles, they retain their sharpness. As these two characteristics are predominant factors in achieving a better polisher, the natural resource gelatin is used and mixed as a bonding material, to produce a pellet-type form. Furthermore, this pellet-type form is attached in the cup-type charcoal polisher, which is then aligned and installed on a vertical plane grinder. This vertical plane grinder carries out abrasion onto silicon wafers. A several nano level roughness has been achieved in polishing expriment.
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  • –1st report : analysis of distribution of abrasive grains from image sequences–
    Akihiro SAKAGUCHI, Naoki TOUGE, Tomoyuki KAWASHITA, Mutsumi TOUGE, Shu ...
    2015 Volume 59 Issue 2 Pages 81-85
    Published: February 01, 2015
    Released on J-STAGE: May 02, 2015
    JOURNAL FREE ACCESS
    Photovoltaic power involves many solar battery cells constituted by a polycrystalline or single crystal silicon wafer. Therefore, the conversion efficiency from solar to electrical energy of each cell is very important. Recently, a fixed grain wire method is employed in a slicing process. Thus, the wire surface topography must be obtained to sustain reliable accuracy. In this paper, a method for measurement of diamond wire surface topography using image processing is proposed. In this method, the distribution of grains on the surface can be expressed numerically after extracting grains from the captured images.
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  • Tsutomu SEKINE
    2015 Volume 59 Issue 2 Pages 86-90
    Published: February 01, 2015
    Released on J-STAGE: May 02, 2015
    JOURNAL FREE ACCESS
    This study focuses on a novel interpretation of path interval determination in multi-axis filleted end milling. Path interval is known as a machining condition able to consider a suitable balance between manufacturing efficiency and machined surface quality. However, the practical formula has not necessarily been provided in multi-axis filleted end milling. As a novel interpretation, this study firstly gave a geometrical expression of filleted end mill through discussing torus's outer peripheral geometry projected on a plane. Then, several path interval formulas were proposed using the expression; moreover, it was verified that the formulas potentially had practical advantages to improving manufacturing efficiency.
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