Grain processing using a charcoal polisher is explored and developed based on natural resources. The proposal is to develop a charcoal polisher and apply it to several areas, such polish processing of semiconductor silicon wafers. Although charcoal can be ground easily, thus facilitating refining, crushing tends to become difficult due to the scale effect. Even with repeated crushing to generate fine particles, they retain their sharpness. As these two characteristics are predominant factors in achieving a better polisher, the natural resource gelatin is used and mixed as a bonding material, to produce a pellet-type form. Furthermore, this pellet-type form is attached in the cup-type charcoal polisher, which is then aligned and installed on a vertical plane grinder. This vertical plane grinder carries out abrasion onto silicon wafers. A several nano level roughness has been achieved in polishing expriment.
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