直径1.7ミリ、長さ6ミリという世界最小の電磁モーターの製作が実現した。作ったのは大阪大学の町田憲一教授をリーダーとするプロジェクト。この成果には、共同研究企業のNEOMAX、

とともに、大阪の地元企業である誠南工業や美和製作所も大いに貢献した。

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Some kinds of dielectric fluids such as dibutyl decanedioate generate jet flow between electrodes. One of authors names the fluids ECFs(Electro-conjugate Fluids), which are considered as smart fluids. In this study, a micro motor by making use of ECF is proposed. On the proposed motor, some pairs of electrodes are located inside of a cylindrical tube(stator)filled with ECF. In the stator, rotational flow is induced by ECF jets. By taking out the rotational flow power with a rotor, micro motors are easily realized. In this paper, fabrication of micro ECF motors having I.D.φ3mm, I.D.φ4mm, I.D.φ8mm is described. Basic characteristics such as rotational velocity, load characteristics, output power, efficiency are experimentally examined. Also, mathematical models of the ECF motor are proposed and verified with experimental data. Finally, miniaturization characteristics are examined through the fabricated ECF motors.

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Disaster response robots require both high output and electrical power saving. The robot hand, which has 4 fingers with 12 joints and 12 DOF, has been developed. The finger has a retention mechanism without electrical power. This paper proposes a new grasping strategy of the robot hand with electrical power saving. Grasping strategy has two actions such as adduction/abduction and flexion/extension. The 1st joint position is determined based on the object shape. The 2nd and 3rd joint are controlled by velocity. When the finger is in contact with the object, it is controlled by periodic motor input. Experimental results show the usefulness of the grasping strategy.

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Disaster response robots require both high output and electrical power saving. This paper presents a new designed robot hand for extreme environments. The robot hand has four fingers with 12 joints and 12 degrees of freedom. The finger has a retention mechanism without electrical power for holding a grasped object. The retention mechanism consists of a motor, a reduction mechanism, a lock mechanism and elastic bodies. Fingertip force is larger than 125 N. Experiment results shows that the robot hand can keep the fingertip force without electrical power. The robot hand fills the requirements for high output and electrical power saving.

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本研究ではウェットエッチングにより加工したPatterned Sapphire Substrateの形状制御メカニズムを解明することを目的とした。硫酸と燐酸の混酸をエッチャントとして用い、その混合比を変えることによるパターン形状への影響を調査した。硫酸の混合比が増加するほど、パターンの穴径は小さくなることが確認された。これは硫酸とサファイアの反応によって生成された物質が結晶のステップに付着し、横方向のエッチングが阻害されたためだと考えられる。

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  An advanced multi-ferroic composite sensor designed by using two material elements of magneto-elasto-electric effect (MEE effect) combined mutual transformation of magnetic property and electric property. This sensor was made by PZT ceramics with high piezoelectric constant and magnetostriction thin film of Fe-20 at%Ga and Fe-50 at%Co with giant magnetostriction and large elastic property in Hirosaki University 2008. From the results of magnetic properties of Fe₈₀Ga₁₅Al₅ and Fe₅₀Co₅₀, properties of magnetostriction materials affect output properties of this composite type sensor. Output voltage increased with decrease of thickness in magnetostriction materials.

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A heat sink with high thermal conductivity is very important part to achieve high efficient and stablenitride semi conductors,such as an optical device for short wavelength laser.Diamond is one of the candidate materials for extremely high thermal conductive heat sink.However,it is difficult to make the diamondsubstrate surface flat in order to obtain a good contact with the laser chip.This paper focuses on a polish ingcharacteristics in terms of crystal orientation on(100) face.As a result,the highest polishing rate is achieved when the polishing direction is in parallel to the <100> crystal orientation.0n the other hand,the lowestpolishing rate but the smoothest surface is obtained in case of the<110>crystal orientation.

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We developed a pattern shape control technique of wet etching Patterned Sapphire Substrate(PSS) by applying Chemical Mechanical Polishing (CMP).We evaluated Round Rate(RR) as a degree of pattern roundness.RR increased with increasing the concentration of colloidal silica,but above 1% concentration of colloidal silica,RR abruptly decreased.The higher applied pressure caused not only higher RR but also reduction of pattern height,which indicates that lower pressure is appropriate for pattern shape control

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