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Proceedings of JIEP Annual Meeting
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The 25th JIEP Annual Meeting
Displaying 151-157 of 157 articles from this issue
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The 25th JIEP Annual Meeting
The mechanical reliability of Sn-Sb micro solder joint
Hitoshi Fujisawa, Masaki Koakutsu, Yoshiharu Kariya, Hirohiko Watanabe ...
Session ID: 8DP-12
Published: 2011
Released on J-STAGE: July 17, 2014
DOI
https://doi.org/10.11486/ejisso.25.0_405
CONFERENCE PROCEEDINGS
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Effect of Crystallographic Orientation on Low-cycle Fatigue Life of β-Sn Single Crystal
Saori Yamada, Kei Otakiri, Yoshiharu Kariya
Session ID: 8DP-13
Published: 2011
Released on J-STAGE: July 17, 2014
DOI
https://doi.org/10.11486/ejisso.25.0_407
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Study on Optimum Material Properties of Underfill Material for High-density LSI Package by using Large-scale FEM Analysis
Satoshi Shimazaki, Yoshiharu Kariya, Toshiyuki Sato, Toshiaki Enomoto, ...
Session ID: 8DP-14
Published: 2011
Released on J-STAGE: July 17, 2014
DOI
https://doi.org/10.11486/ejisso.25.0_409
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Relationship between Morphology and Undercooling of β-Sn After Growth of Primary Intermetallic Compounds in Sn- Ag and Sn-Cu alloys
Yoshiko Takamatsu, Esaka Hisao, Kei Shinozuka
Session ID: 8DP-15
Published: 2011
Released on J-STAGE: July 17, 2014
DOI
https://doi.org/10.11486/ejisso.25.0_411
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Development of Pd-P Film for Au/Pd/Ni Electroplating
Ikuhiro Kato, Yuki Asanuma, Yoshinori Murakami, Hideto Watanabe, Hideo ...
Session ID: 8DP-16
Published: 2011
Released on J-STAGE: July 17, 2014
DOI
https://doi.org/10.11486/ejisso.25.0_413
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Study of thick polyimide films by screen printing
Sigemasa Segawa, Toshiyuki Goshima, Shuzo Waki
Session ID: 8DP-17
Published: 2011
Released on J-STAGE: July 17, 2014
DOI
https://doi.org/10.11486/ejisso.25.0_415
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Three-Dimensional (3D) Patterning Technology of Electroless Nickel Alloy Film
Yi Zhang, Toshihiro Itoh, Hideki Takagi, Ryutaro Maeda, Akira Toda, Ta ...
Session ID: 8DP-18
Published: 2011
Released on J-STAGE: July 17, 2014
DOI
https://doi.org/10.11486/ejisso.25.0_417
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(689K)
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