[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

An abnormal voltage passed on to an aluminum electrolytic capacitor increases its temperature, resulting in the vaporization of the electrolyte and an increase in internal pressure. When the capacitor's pressure valve is actuated due to the internal pressure rising above a certain level, the gasified electrolyte is instantaneously discharged. We have developed a new material to absorb the electrolyte and report the effect of the absorbent.

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

We propose a novel optical interconnection of a reconfigurable wavelength addressed optical waveguide multi-layers wiring. For the purpose, we propose a transparent micro passive wavelength selector (T-MPWS). We designed the T-MPWS module of a bilateral telecentric system which was operated by using the wavelength of 470nm, 520nm, and 570nm as triple-layers. And we simulated the coupling efficiency and alignment tolerance. We found that the wavelength addressing operation of the T-MPWS was effective for the optical waveguide multi-layers wiring between the OE-PWBs.

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

High index photocurable resin doped with ZrO<sub>2 nanoparticles is prepared. Compact optical waveguide is designed using high index core material and is fabricated by UV nanoimprint technique.

View full abstract

[in Japanese]

View full abstract

The unique concept and methodology of self-assembly even in micro-meter scale were developed in which micro molten solder drops could form in a small parallel gap between co-planar surfaces of chips and substrates with array copper traces (typically 100 to 300 m pitches) in polymer resin. In this report the geometry and yielding ratio of vertical and lateral solder bump bridges before self-formation were compared with varying filler content, copper land pitch, and gap space. The formation of bump arrays (100 to 300 micron pitch) can be achievable.

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

Pb(Zr,Ti)O3(PZT) is used as a high dielectric capacitor, and can be formed by nanotransfer on non-heat-resisting substrates. Nanotransfer has a releasing process. The releasing characteristics have the relationships with the thickness of Pt layer. The scratch testing is carried out in order to measure adhesion force between Pt and SiO2 quantitatively. As a result, the thicker Pt layer is, the more easily Pt layer peels off. This experimental result will be useful in the bonding process between the dielectric capacitor and the transferred substrate for the packaging technology.

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

We reports on the fabrication and characterization of meter-scaletouch sensors. For the applications to wearable keyboards and bedsensors for elders, large area touch sensors are inevitable, butconventional MEMS force sensors are not suitable because of theirsmall area. Therefore, we developed the techniques to coat conductivepolymer on long fibers and weave fibers, forming large area sensors.The capacitive type touch sensors have been constructed with wovensensor fabric. The area of the fabric covers 1 meter-square.

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

An isostatic conductive paste(ICP)where metal particles/flakes are dispersed in a resin is a viable candidate for printable paste materials.Transmission characteristics at GHz is evaluated by measuring eye-patterns and S-parameters. The results showed that the ICP exhibits better aracteristics than the Cu wiring up to 12 Gbps.The reason for better characteristics is considered to be due to the series capacitance between dispersed Ag flakes.

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

The suppression effect of resonance by capacitor with series resistor on power-ground planes of printed wiring board was investigated by measurement. The common mode radiation generated by printed wiring board with power-ground planes was measured by Workbench faraday Cage. The radiation was reduced by capacitors with series resistors connected between power and ground planes at four corners. The experiment was carried out on some boards with different size and thickness and similar results were obtained.

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

Dimers synthesized from polyhydric phenols were investigated as curing agents for epoxy resins. In this study, using several types of epoxy resin, equivalent ratio of curing agent, curing conditions, and the relations of thermal mechanical properties were examined.

View full abstract

In order to improve the thermalstability of cyanate ester resin, compounding ratio of two type cyanate ester resins was examined. And, toughening of cyanete ester resin was carried out by simultaneous curing of the resin with radical copolymerization of N-phenylmareimide, styrene and VBPEO 2000.

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

Power integrity design is a critical issue in system-in-packages (SiP's). In particular, power supply disturbance excited by simultaneous switching output (SSO) noise, or core circuits is serious in a 3D stacked die packages. In this paper, a test chip was designed and fabricated to generate noise and to monitor on-chip power supply noise. Power supply noises were examined in various decoupling schemes.

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract