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Yuki Tsuno, Yuki Nagao, Yasuhiro Tanabe, Kouitiro Murahasi, Tooru Mori ...
Session ID: 10B-02
Published: 2011
Released on J-STAGE: July 17, 2014
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Sigemasa Segawa, Toshiyuki Goshima, Shuzo Waki
Session ID: 10B-03
Published: 2011
Released on J-STAGE: July 17, 2014
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Makoto Kohtoku, Yaichirou Nakamaru
Session ID: 10B-04
Published: 2011
Released on J-STAGE: July 17, 2014
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Yoshito Tsukahara, Shigeru Watariguchi, Kazutaka Tajima, Takayasu Yosh ...
Session ID: 10B-05
Published: 2011
Released on J-STAGE: July 17, 2014
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Yohei Wakuda, Masaharu Sugimoto, Mitsuhiro Wanatabe, Tsugito Yamashita ...
Session ID: 10B-06
Published: 2011
Released on J-STAGE: July 17, 2014
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Shunya Takahashi, Sachio Yoshihara, Junichi Nozawa, Naokatsu Nojiri
Session ID: 10B-07
Published: 2011
Released on J-STAGE: July 17, 2014
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Takuya Akiba, Sachio Yoshihara, Mitsuyoshi Matsuda
Session ID: 10B-08
Published: 2011
Released on J-STAGE: July 17, 2014
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Takehiro Tokuno, Masaya Nogi, Katsuaki Suganuma
Session ID: 10B-09
Published: 2011
Released on J-STAGE: July 17, 2014
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Kenji Hara, Tomoyuki Iwashima, Jin-ichi Omi, Takashi Sueyoshi, Seiichi ...
Session ID: 10B-10
Published: 2011
Released on J-STAGE: July 17, 2014
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Koichi Mori, Minoru Yagi, Misturu Nozue, Shigeaki Sato
Session ID: 10B-11
Published: 2011
Released on J-STAGE: July 17, 2014
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An abnormal voltage passed on to an aluminum electrolytic capacitor increases its temperature, resulting in the vaporization of the electrolyte and an increase in internal pressure. When the capacitor's pressure valve is actuated due to the internal pressure rising above a certain level, the gasified electrolyte is instantaneously discharged. We have developed a new material to absorb the electrolyte and report the effect of the absorbent.
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Arihiro Matsunaga, Minoru Yoshikawa
Session ID: 10B-12
Published: 2011
Released on J-STAGE: July 17, 2014
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Shigeyuki Yanagimachi
Session ID: 10C-01
Published: 2011
Released on J-STAGE: July 17, 2014
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Kenichi Nakama, Osamu Mikami
Session ID: 10C-02
Published: 2011
Released on J-STAGE: July 17, 2014
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We propose a novel optical interconnection of a reconfigurable wavelength addressed optical waveguide multi-layers wiring. For the purpose, we propose a transparent micro passive wavelength selector (T-MPWS). We designed the T-MPWS module of a bilateral telecentric system which was operated by using the wavelength of 470nm, 520nm, and 570nm as triple-layers. And we simulated the coupling efficiency and alignment tolerance. We found that the wavelength addressing operation of the T-MPWS was effective for the optical waveguide multi-layers wiring between the OE-PWBs.
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Yusuke Matsuzawa, Tomohiro Wakita, Yu Tokiwa, Kenichi Nakama, Osamu Mi ...
Session ID: 10C-03
Published: 2011
Released on J-STAGE: July 17, 2014
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Tomotsugu Kinoshita, Hiroki Itou, kouji Ishida
Session ID: 10C-04
Published: 2011
Released on J-STAGE: July 17, 2014
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Keishiro Shitanda, Hsiang Han Hsu, Takaaki Ishigure
Session ID: 10C-05
Published: 2011
Released on J-STAGE: July 17, 2014
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Okihiro Sugihara, Shimpei Kudo, Shu Kaneko, Shoichi Kubo, Masaru Nakag ...
Session ID: 10C-06
Published: 2011
Released on J-STAGE: July 17, 2014
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High index photocurable resin doped with ZrO<sub>2 nanoparticles is prepared. Compact optical waveguide is designed using high index core material and is fabricated by UV nanoimprint technique.
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Keisuke Saito, Ryutaro Tsuchiya, Hiroyoki Nisikawa, Hideomi Hayashi
Session ID: 10C-07
Published: 2011
Released on J-STAGE: July 17, 2014
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Kiyokazu Yasuda
Session ID: 10C-08
Published: 2011
Released on J-STAGE: July 17, 2014
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The unique concept and methodology of self-assembly even in micro-meter scale were developed in which micro molten solder drops could form in a small parallel gap between co-planar surfaces of chips and substrates with array copper traces (typically 100 to 300 m pitches) in polymer resin. In this report the geometry and yielding ratio of vertical and lateral solder bump bridges before self-formation were compared with varying filler content, copper land pitch, and gap space. The formation of bump arrays (100 to 300 micron pitch) can be achievable.
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hiroki oshikawa, Shinichi Yamamoto, Eiji Higurashi, Tadatomo Suga, sak ...
Session ID: 10C-09
Published: 2011
Released on J-STAGE: July 17, 2014
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Yusuke Ohashi, Ken Suzuki, Hideo Miura
Session ID: 10C-10
Published: 2011
Released on J-STAGE: July 17, 2014
CONFERENCE PROCEEDINGS
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Jun Umeda, Chenxi Wang., Tadatomo Suga
Session ID: 10C-11
Published: 2011
Released on J-STAGE: July 17, 2014
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Fumiaki Tomioka, Masaaki Ichiki, Tadatomo Suga, Toshihiro Itou, Keita ...
Session ID: 10C-12
Published: 2011
Released on J-STAGE: July 17, 2014
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Pb(Zr,Ti)O3(PZT) is used as a high dielectric capacitor, and can be formed by nanotransfer on non-heat-resisting substrates. Nanotransfer has a releasing process. The releasing characteristics have the relationships with the thickness of Pt layer. The scratch testing is carried out in order to measure adhesion force between Pt and SiO2 quantitatively. As a result, the thicker Pt layer is, the more easily Pt layer peels off. This experimental result will be useful in the bonding process between the dielectric capacitor and the transferred substrate for the packaging technology.
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Mitsuhiro Yoshida, Yoshiaki Ukita, Yoshito Hirose, Kunihiko Mabuchi, Y ...
Session ID: 10C-13
Published: 2011
Released on J-STAGE: July 17, 2014
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Takahiro Yamashita, Toshihiro Itoh, Tadatomo Suga
Session ID: 10C-14
Published: 2011
Released on J-STAGE: July 17, 2014
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Yoshinori Yokoyama, Takaaki Murakami, Takashi Tokunaga, Toshihiro Itoh
Session ID: 10C-15
Published: 2011
Released on J-STAGE: July 17, 2014
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Seiichi Takamatsu, Takeshi Kobayashi, Nobuhisa Shibayama, Koji Miyake, ...
Session ID: 10C-16
Published: 2011
Released on J-STAGE: July 17, 2014
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We reports on the fabrication and characterization of meter-scaletouch sensors. For the applications to wearable keyboards and bedsensors for elders, large area touch sensors are inevitable, butconventional MEMS force sensors are not suitable because of theirsmall area. Therefore, we developed the techniques to coat conductivepolymer on long fibers and weave fibers, forming large area sensors.The capacitive type touch sensors have been constructed with wovensensor fabric. The area of the fabric covers 1 meter-square.
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Yusuke Suzuki, Yusuke Ohashi, Masato Ohnishi, Ken Suzuki, Hideo Miura
Session ID: 10C-17
Published: 2011
Released on J-STAGE: July 17, 2014
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Shuhei Wadayama, Yoshio Kobayashi, Zhewang Ma
Session ID: 10E-01
Published: 2011
Released on J-STAGE: July 17, 2014
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Shogo Kaneko, Yoshio Kobayashi, Zhewang Ma
Session ID: 10E-02
Published: 2011
Released on J-STAGE: July 17, 2014
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Kaoru Hashimoto, Yutaka Akiyama, Kazuo Kohno, Kanji Otsuka, Katsuaki S ...
Session ID: 10E-03
Published: 2011
Released on J-STAGE: July 17, 2014
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An isostatic conductive paste(ICP)where metal particles/flakes are dispersed in a resin is a viable candidate for printable paste materials.Transmission characteristics at GHz is evaluated by measuring eye-patterns and S-parameters. The results showed that the ICP exhibits better aracteristics than the Cu wiring up to 12 Gbps.The reason for better characteristics is considered to be due to the series capacitance between dispersed Ag flakes.
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Masayuki Tsunemitsu, Yoshio Kobayashi, Zhewang Ma
Session ID: 10E-04
Published: 2011
Released on J-STAGE: July 17, 2014
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Kunihito Baba, Mitsuhiro Watanabe, Keiko Kitamura, Jyunko Takahashi, T ...
Session ID: 10E-05
Published: 2011
Released on J-STAGE: July 17, 2014
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Yohei Koga, Takashi Yamagajo
Session ID: 10E-06
Published: 2011
Released on J-STAGE: July 17, 2014
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Masanori Naito, Toshiyuki Kaneko, Kiyohiko Kaiya
Session ID: 10E-07
Published: 2011
Released on J-STAGE: July 17, 2014
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Tatsuya Sakai, Takashi Sakusabe, Takehiro Takahashi, Noboru Schibuya
Session ID: 10E-08
Published: 2011
Released on J-STAGE: July 17, 2014
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Takehiro Takahashi, Jun Saito, Takashi Sakusabe, Noboru Schibuya
Session ID: 10E-09
Published: 2011
Released on J-STAGE: July 17, 2014
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The suppression effect of resonance by capacitor with series resistor on power-ground planes of printed wiring board was investigated by measurement. The common mode radiation generated by printed wiring board with power-ground planes was measured by Workbench faraday Cage. The radiation was reduced by capacitors with series resistors connected between power and ground planes at four corners. The experiment was carried out on some boards with different size and thickness and similar results were obtained.
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Narimasa Takahashi
Session ID: 10E-10
Published: 2011
Released on J-STAGE: July 17, 2014
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Aihua Li, Tohlu Matsushima, Osami Wada
Session ID: 10E-11
Published: 2011
Released on J-STAGE: July 17, 2014
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Takashi Kobayashi, Yuto Horiuchi, Toshiyuki Oyama, Akio Takahashi
Session ID: 8DP-01
Published: 2011
Released on J-STAGE: July 17, 2014
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Dimers synthesized from polyhydric phenols were investigated as curing agents for epoxy resins. In this study, using several types of epoxy resin, equivalent ratio of curing agent, curing conditions, and the relations of thermal mechanical properties were examined.
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Manabu Isono, Toshiyuki Oyama, Akio Takahashi
Session ID: 8DP-02
Published: 2011
Released on J-STAGE: July 17, 2014
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In order to improve the thermalstability of cyanate ester resin, compounding ratio of two type cyanate ester resins was examined. And, toughening of cyanete ester resin was carried out by simultaneous curing of the resin with radical copolymerization of N-phenylmareimide, styrene and VBPEO 2000.
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Aya Kasahara, Akio Takahashi, Toshiyuki Oyama
Session ID: 8DP-03
Published: 2011
Released on J-STAGE: July 17, 2014
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Yoshinori Koyama, Naoki Okamoto, Takeyasu Saito, Isao Morimoto, Takayu ...
Session ID: 8DP-04
Published: 2011
Released on J-STAGE: July 17, 2014
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Jun Watanabe, Norihisa Sekimori, Makoto Miyazaki, Kenji Hatsuzawa, Tak ...
Session ID: 8DP-05
Published: 2011
Released on J-STAGE: July 17, 2014
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Toshio Sudou, Masahide Nose, Mayumi Sakai, Tomohiro Yoshizawa
Session ID: 8DP-06
Published: 2011
Released on J-STAGE: July 17, 2014
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Masato Kanazawa, Hayato Sasaki, Toshio Sudo, Atsushi Tomishima, Toshiy ...
Session ID: 8DP-07
Published: 2011
Released on J-STAGE: July 17, 2014
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Koji Sakuma, Toshio Sudo
Session ID: 8DP-08
Published: 2011
Released on J-STAGE: July 17, 2014
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Takafumi Okumura, Yoshiaki Oizono, Yoshitaka Nabeshima, Toshio Sudo
Session ID: 8DP-09
Published: 2011
Released on J-STAGE: July 17, 2014
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Power integrity design is a critical issue in system-in-packages (SiP's). In particular, power supply disturbance excited by simultaneous switching output (SSO) noise, or core circuits is serious in a 3D stacked die packages. In this paper, a test chip was designed and fabricated to generate noise and to monitor on-chip power supply noise. Power supply noises were examined in various decoupling schemes.
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Junki Oshikiri, Tatunosuke Nakada, Hiroshi Umemoto, Akira Hashimoto, I ...
Session ID: 8DP-10
Published: 2011
Released on J-STAGE: July 17, 2014
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sayaka arashiro, Kunihito Baba, Katsuhiko Tashiro, Mitsuhiro Watanabe, ...
Session ID: 8DP-11
Published: 2011
Released on J-STAGE: July 17, 2014
CONFERENCE PROCEEDINGS
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