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The 25th JIEP Annual Meeting

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The 25th JIEP Annual Meeting

WLP-IC and Passive Devices Embedded Multilayer Polyimide Wiring Board

Nobuki Ueta, Masahiro Okamoto, Yoshinori Sano, Satoshi Okude, Takanao ...

Session ID: 9B-04
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_144

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PDN Impedance Evaluation of Decoupling Capacitor Embedded Interposer for 3D-Integrated LSI System

Katsuya Kikuchi, Yutaka Akiyama, Kei Shimakura, Koichi Takemura, Toshi ...

Session ID: 9B-05
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_146

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Warpage Prediction of Ball Grid Array Package Using a Homogenization Method

Tomohisa Suzuki, Takeshi Terasaki, Toshiaki Tanaka, Masaaki Takekoshi

Session ID: 9B-06
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_148

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Improvement of the accuracy of the nonlinear finite element analyses for a 3D-SIC using the strain measurement by the digital image correlation

Masatoshi Oka, Shinya Kawahara, Toru Ikeda, Noriyuki Miyazaki

Session ID: 9B-07
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_152

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Reliability Evaluation of Fatigue Life for Solder Joints in Chip Components Considering Dispersion of the Properties

Yuji Nishimura, Qiang Yu

Session ID: 9B-08
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_155

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Thermal Stress in the SiC Power Device under the High Temperature Operation

Seung Chol Choi, Hiroshi Sato, Hiroshi Nakagawa, Fengqun Lang, Liuxiao ...

Session ID: 9B-09
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_159

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Experimental Evaluation of Thermal Fatigue Crack Propagation Process in Solder Joints of Chip Resistors by Synchrotron Radiation X-ray Micro-tomography

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takay ...

Session ID: 9B-10
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_161

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Relationship between growth rate of interfacial reaction layer and carbon content in solder/carbon steel system

takaaki kawamoto, Akira Yamauchi, Satoshi Kawakubo, Atsushi Irisawa, K ...

Session ID: 9B-11
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_165

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Reaction behavior of Fe and carbon steels in molten Sn-3.0%Ag-0.5%Cusolder was investigated. The thickness of the reaction layer was foundto increase parabolically with immersion time at 623 and 673 K for Feand 0.2% carbon steel. At 723 K, the thickness was found to increaselinearly with immersion time. The growth of the reaction layer betweensolder and 0.4% and 0.6% carbon steels becomes very slow at 723K withthe progress time. This is attributed to the formation of cementitephase at the interface.

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Statistical Analysis Method for Printed Circuit Board Subjected to Random Dynamic Load

Yousuke Hisakuni, Takahiro Omori, Kenji Hirohata, Minoru Mukai

Session ID: 9B-12
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_167

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Reliability Evaluation of Electronic Devices under Considering the Actual use conditions

Shilin Liu, Qiang Yu, Masahiro Kobayasi

Session ID: 9B-13
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_171

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Fatigue life evaluation Using power device computing model

kazunori shinohara, qiang Yu

Session ID: 9B-14
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_174

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To verify the calculation accuracy of this fatigue life evaluation method for a power device, we investigate how the mesh resolution affects the fatigue life evaluation. This method is based on the finite element method. Therefore, the calculation accuracy of the fatigue life evaluation depends on the mesh resolution. We investigate how the mesh resolution affects the fatigue life evaluation.

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Effect of Thermal Cycling Conditions on Thermal Fatigue Life of Sn-Ag-Cu Solder Joints

Tomoko Monda, Minoru Mukai, Kenji Hirohata

Session ID: 9B-15
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_178

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Thermal fatigue life evaluation for solder joints of DBA substrate used for vehicle power device

Shiqing Zhao, Qiang Yu, Hiroki Akaeda

Session ID: 9B-16
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_180

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Effect of Micro Structure on Fatigue Characteristics of Lead Free Solder Joint

Takahiro Akutsu, Qiang Yu

Session ID: 9B-17
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_183

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Influence of cyclic strain hardening exponent on fatigue ductility exponent for Sn based alloy

Yoshihiko Kanda, Yuji Oto, Yuusuke Shiigi, Yoshiharu Kariya

Session ID: 9B-18
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_187

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Printing of conductive paste for acrylate coating agents

Munenori Yamashita, Kouhei Takada, Takashi Mori, Tetsuya Matoba, Minor ...

Session ID: 9C-01
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_191

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Workfunction control of metal electrode for printed device

Manabu Yoshida, Kouji Suemori, Sei Uemura, Sa Hoshino, Noriyuki Takada ...

Session ID: 9C-02
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_193

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High frequency characteristics of a copper-clad laminate by using plating on a liquid crystal polymer

Kenichi Ohga, Kimiko Fujisawa, Satoru Zama, Satoru Torimitu, Toshihide ...

Session ID: 9C-03
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_195

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Packaging Technologies for Power Device

Hiroshi Hozoji, Toshiaki Ishii, Toshiaki Morita, Yuusuke Yasuda

Session ID: 9C-04
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_197

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Development of high-rate Cu electrodeposition for TSV using Diallylamine additives

Taro Hayashi, Minoru Takeuchi, Naoki Okamoto, Takeyasu Saito, Kazuo Ko ...

Session ID: 9C-05
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_199

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Feasibility of Electrical Testing of Loaded Boards Based on IEEE1149.1 Test Mechanism

Masaki Hashizume, Tomoaki Konishi, Hiroyuki Yotsuyanagi

Session ID: 9C-06
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_201

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Fault Analysis of Soft Opens at TSVs by 3D Electromagnetic Simulation

Shohei Kondo, Hiroyuki Yotsuyanagi, Masaki Hashizume

Session ID: 9C-07
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_205

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Nondestructive Inspection of Automotive PCB and Mounted Electronic Components by Time Domain Reflectometry (TRD) Method

Kazuki Nakano, Masao Kanatani, Hiroyuki Ishii, Mutsumi Shimazaki

Session ID: 9C-08
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_207

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Study on Defect Inspection System for Minute Printed Wiring Boards by using Capacitance

masanori noguchi, Okitoshi Tsunoda, Hideo Tomita, Yukio Saito

Session ID: 9C-09
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_209

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The objective of this research project is to address this need for automatic measurement techniques for PWBs by offering an alternative. As an improvement upon current complicated measurement techniques, such as image processing inspection by pattern matching or optic microscope inspection systems, a capacitance line-width measurement systems with a novel design of a measurement probe.

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Performance Improvement of Organic Thin-Film Solar

Yusuke Tajima

Session ID: 9C-10
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_211

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Bulk hetero-junction (BHJ) solar cells offer the potential to greatly decrease the cost of photovoltaic energy due to lower material and manufacturing costs. But the power conversion efficiencies of the BHJ cells must make great strides to realize widespread commercialization of them, and such improvements will require new semiconductor materials constituting the active layer. This work aimed to research on the development of a new class of fullerene derivatives controlled the redox and the self-assembling properties, which can be used as n-type materials for BHJ cells.

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The effect of nickel-phosphorus undercoat on corrosion resistance for electronic parts.

Yoshihiro Tadokoro, Tsuyoshi Furusawa, Masahide Sato, Noboru Suzuki

Session ID: 9C-11
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_215

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Electroless Ni/Pd/Au Plating for Cu Wire Bonding

Yoshinori Ejiri, Takehisa Sakurai, Hiroshi Kurokawa, Kuniji Suzuki, Yo ...

Session ID: 9C-12
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_217

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We investigated the Cu and Au wire bonding reliability in electroless Ni/Au plating, electroless Ni/Pd/Au plating and electrolytic Ni/Au plating on the semiconductor package substrate. We found that the minimum Au thickness of electroless Ni/Au and electrolytic Ni/Au for the good wire bonding reliability is 0.3 micrometer. In the case of electroless Ni/Pd/Au, the minimum Au thickness is 0.1 micrometer. These results indicate that electroless Ni/Pd/Au has an advantage on Au thickness as compared with electroless Ni/Au and electrolytic Ni/Au for Cu wire bonding.

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Basic Examination of Metallization to Different Material Used for W-CSP by Electroless Plating Method

Hiroshi Umemoto, Junki Oshikiri, Tatsunosuke Nakada, Akira Hashimoto, ...

Session ID: 9C-13
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_219

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Characterization of Chip on Chip Connection with Micro Au Bump Array Made by Non-Cyanide Electroless Plating

Yohtaro Yasu, Katsuya Kikuchi, Fumiki Kato, Shunsuke Nemoto, Hiroshi N ...

Session ID: 9C-14
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_221

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Study for Chip-Stacking Technology with Cu bumps by Mechanical caulking at room temperature

Michihiro Kawashita, Yasuhiro Yoshimura, Hitoyuki Tomotsune, Naotaka T ...

Session ID: 9C-15
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_223

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Effect of preheating condition　on the Sinterability in Vacuum Atomosphere of Joins using Cu Nanoparticle Paste

Tomohiro Yamakawa, Masayoshi Shimoda, Kunio Shiokawa, Masayuki Ueda, S ...

Session ID: 9C-16
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_227

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Au Cone-Bump by Nanoparticle deposition technology

Fumito Imura, Xiaojun Liu, Shunsuke Nemoto, Fumiki Kato, Katsuya Kikuc ...

Session ID: 9C-17
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_229

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Metallization to Ga-P LED devices

tatsuya tomita, takatosi hara, yuu watanabe, tatsumune nasu, yuuki hai ...

Session ID: 9C-18
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_233

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Micromachining of Polyimide Using Proton Beam Writing

Yutaka Takeno, Takuya Hamada, Hiroyuki Nishikawa, Hideomi Hayashi

Session ID: 9C-19
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_235

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Experimetal data analysis on total driving performance of series chopper based EV power train

sota tsutsuki, atsuo kawamura

Session ID: 10A-01
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_237

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KAST Power Electronics project will be summarized.

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Extremely high thermal properties of Boron Nitride-epoxy composite with high orientation

Kenji Miyata, Toshitaka Yamagata, Tadafumi Adschiri

Session ID: 10A-02
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_239

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Diffusion mechanism of thin-film multi layer of AlN submount

Yukio Nagano, Kensaku Nakashima, Masatoshi Oota, Kazuyoshi Uematsu

Session ID: 10A-03
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_241

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Reliability Evaluation and Specifying Factor of Fatigue Mode on Power Device Using Coupled Electrical-Thermal-Mechanical Analysis

Masahiro Kobayashi

Session ID: 10A-04
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_245

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System Simulation for Power Electronics System

Koichi Shigematsu, Misao Kato

Session ID: 10A-05
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_249

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Reliability Evaluation of Ni Plating in a High Temperature Power Device

Takayuki Ishikawa, Toshikazu Oshidari, Hiromi Sugihara, Qiang Yu

Session ID: 10A-06
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_253

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Fundamental Solder Mount Properties of Bi-Ag High Temperature Lead-free Solders

Masayoshi Shimoda, Tomohiro Yamakawa, Kunio Shiokawa, Hiroshi Nishikaw ...

Session ID: 10A-07
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_257

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Development and durability analysis of flexible dye-sensitized solar cells

Tsutomu Miyasaka, Masashi Ikegami

Session ID: 10A-08
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_259

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Evaluation of semiconductor package process with Low-k TEG wafer

Tetsuya Todaka, Hazime Tomokage, Osamu Horiuchi, Shigehiro Hayasi, Woo ...

Session ID: 10A-09
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_263

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A Study on the Thermal Deformation and the Mechanical Properties Due to Curing Process of the Encapsulation Resin

Hiroyuki Sato, Qiang Yu, Ryusuke Sone

Session ID: 10A-10
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_267

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Deformation of Resin Materials Due to the Curing in the Thermal process

ryusuke sone, Qiang Yu, Hiroyuki Sato

Session ID: 10A-11
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_270

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Micro-texture dependence of joint reliability of electroplated copper interconnections

Naokazu Murata, Naoki Saito, Kinji Tamakawa, Ken Suzuki, Hideo Miura

Session ID: 10A-12
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_274

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Dominant factor of the stress-induced migration in electroplated copper thin-film interconnections

Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura

Session ID: 10A-13
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_276

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Location Prediction of Tin-Whiskers Generation during Thermal Cycle Test

Takeshi Tearsaki, Takahiko Kato, Yasutaka Ookura, Tomio Iwasaki, Masat ...

Session ID: 10A-14
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_278

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A Study on Thermal Fatigue Reliability of High-Temperature-Resistant Joint for Power Devices Which Considers Fatigue Property of Ni Plating

Hiromi Sugihara, Toshikazu Oshidari, Takayuki Ishikawa, Qiang Yu

Session ID: 10A-15
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_282

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Development of highly Reliable Rigid-Flexible Printed Wiring Board

hiroyasu amemiya, katsumune kato, kinya ishiguro, masakazu tatsumi

Session ID: 10B-01
Published: 2011
Released on J-STAGE: July 17, 2014

DOIhttps://doi.org/10.11486/ejisso.25.0_286

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