Journal of the Metal Finishing Society of Japan
Online ISSN : 1884-3395
Print ISSN : 0026-0614
ISSN-L : 0026-0614
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Volume 16, Issue 11
Displaying 1-9 of 9 articles from this issue
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  • The Relationship Between Accelerated Corrosion Test and Outdoor Exposure Test of Electroplated Coatings (2)
    Shigeru SUGA
    1965 Volume 16 Issue 11 Pages 489-492
    Published: November 20, 1965
    Released on J-STAGE: October 30, 2009
    DOIhttps://doi.org/10.4139/sfj1950.16.489
    JOURNAL FREE ACCESS
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  • Effects of Layer Conditions on Grinding Power of the Wheel
    Studies on Grinding Wheels Produced by Nickel Electroplating (Part III)
    Matsuhei KISNI, Hideo YAMAMOTO, Urako KIYONO
    1965 Volume 16 Issue 11 Pages 493-496
    Published: November 20, 1965
    Released on J-STAGE: October 30, 2009
    DOIhttps://doi.org/10.4139/sfj1950.16.493
    JOURNAL FREE ACCESS
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    For the purpose of studing the effects of layer conditions on grinding power of the wheel, experiments were conducted on 3 kinds of electroplated wheels with various plating conditions. The abrasive particles used were alumina #150.
    The Electroplatings were carried out by the following processes:
    (a) Plated in bright nickel bath (HV=550).
    (b) Plated in nickel sulfamide bath (HV=200).
    (c) Plated by mixing with fine particles in nickel sulfamide bath.
    The following results were obtained.
    (1) The grinding power was greater with less wear of wheel when the hardness of the plated layer was higher.
    (2) The grinding power was advanced by soft plated layer including admixed fine particles.
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  • Erratum to : Colouring Anodic Oxide Coatings of Aluminium
    1965 Volume 16 Issue 11 Pages 496
    Published: 1965
    Released on J-STAGE: October 30, 2009
    DOIhttps://doi.org/10.4139/sfj1950.16.11_496
    JOURNAL FREE ACCESS
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  • Studies on Electroplated Grinding Wheel with Diamond Abrasive Particles
    Studies on Grinding Wheel Produced by Nickel Electroplating (Part IV)
    Matsuhei KISHI, Hideo YAMAMOTO, Urako KIYONO
    1965 Volume 16 Issue 11 Pages 497-500
    Published: November 20, 1965
    Released on J-STAGE: October 30, 2009
    DOIhttps://doi.org/10.4139/sfj1950.16.497
    JOURNAL FREE ACCESS
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    A grinding wheel was manufactured for trial by nickel electroplating with diamond abrasive particles on steel disc (45mm∅) in single layer and its grinding power was examined.
    As the results, it was found that the greatest power was obtained when the particles were embedded to the depth of 90% (based on average shorter diameter of particles); but it was diminished when the depth was more or less than the above value.
    When the particles were firmly bonded with the wheel, the wear of diamond was only about 0.7% in the grinding test (against quenched steel) for 1hr.
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  • Electroless Copper Plating
    Studies of Plating on Plastics (Part 2)
    Saburo KONISHI
    1965 Volume 16 Issue 11 Pages 501-511
    Published: November 20, 1965
    Released on J-STAGE: October 30, 2009
    DOIhttps://doi.org/10.4139/sfj1950.16.501
    JOURNAL FREE ACCESS
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    In electroless copper plating solution, the reaction among copper sulfate, Rochelle salt, and sodium hydroxide is shown by the following equation:
    Reaction of deposition of copper is shown by the following equation:
    When this solution is settled for a time, sodium hydroxide is decomposed by the reactions shown in the following two equations:
    NaOH+CO2→NaHCO3…… (3)
    NaOH+2HCHO→HCOONa+CH3OH…… (4)
    It is derived from the four equations mentioned above that 4 mol or more of sodium hydroxide, 1 mol or more of Rochelle salt, and 2 mol or more of formalin are required for the deposition of 1 mol of copper.
    Rate of deposition of copper is proportional to the temperature and the amounts of copper sulfate and sodium hydroxide in plating solution. However, self-decomposition of the solution will take place with the increase of the above amounts or temperature rise. The rate is promoted by mechanical stirring of the plating solution, which will prevent self-decomposition.
    For preventing self-decomposition in the solution of high concentration, it is effective to add 1-3g/l of potassium cyanide to the solution. However, as the effects of the addition, the rate of deposition is lower and blackish brown deposit in initial stage has much less adhesive power.
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  • Hardness of Electrodeposited Plating Film of W-Ni Alloy
    Susumu MORIOKA, Yoshinobu SAWADA, Reiji SHIMAZAKI
    1965 Volume 16 Issue 11 Pages 512-516
    Published: November 20, 1965
    Released on J-STAGE: October 30, 2009
    DOIhttps://doi.org/10.4139/sfj1950.16.512
    JOURNAL FREE ACCESS
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    The object of this study was to determine the effects of heat treatment on the hardness of W-Ni alloy plating films electrodeposited from citric acid-ammoniacal plating solution, which was proposed by Vaaler and Holt, containing 20g/l of NiSO4⋅6H2O, 50g/l of Na2WO4⋅2H2O, 66g/l of citric acid, and NH4OH for giving a definite pH. The solution was used at 60°C, pH of 8.6-8.9 and current density of 10A/dm2 based on a series of preliminary tests.
    The following results were obtained.
    (1) The hardness of W-Ni alloy plating film, heated in vacuum up to a certain temperature below 600°C, was remarkably increased; it would be due to precipitation hardening. The hardness was more increased with the increase of tungsten content and with the higher temperature of heating (within the range of below 600°C). For example, the hardness of 40% W-Ni alloy plating film heated at 600°C was HV 1075.
    (2) The fact of hardening of W-Ni alloy plating films containing less than 30% of W was explained well by the laminated structure of cathode deposit consisting of alternate layers of Ni and W-Ni solid solution.
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  • [title in Japanese]
    [in Japanese]
    1965 Volume 16 Issue 11 Pages 517-519
    Published: November 20, 1965
    Released on J-STAGE: October 30, 2009
    DOIhttps://doi.org/10.4139/sfj1950.16.517
    JOURNAL FREE ACCESS
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  • [title in Japanese]
    [in Japanese]
    1965 Volume 16 Issue 11 Pages 520-525
    Published: November 20, 1965
    Released on J-STAGE: October 30, 2009
    DOIhttps://doi.org/10.4139/sfj1950.16.520
    JOURNAL FREE ACCESS
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  • [title in Japanese]
    [in Japanese]
    1965 Volume 16 Issue 11 Pages 526-531
    Published: November 20, 1965
    Released on J-STAGE: October 30, 2009
    DOIhttps://doi.org/10.4139/sfj1950.16.526
    JOURNAL FREE ACCESS
    Download PDF (752K)
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