Study was made on the inhibitor action of addition agents in the electrodeposition of nickel from nickel chloride bath.
For the examination of the adsorption phenomena of the addition agents on the nickel surface, the capacity of double layer and the polarization potential during the hydrogen discharge on the nickel electrode in 0.1
N HCl solution were measured with respect to the concentration of the addition agents.
During the hydrogen discharge reaction, saccharin, thiourea, β-naphthoquinoline, and N-ethyl quinolium iodide reduced the differential capacity of double layer in 0.1
N HCl solution.
It was found that saccharin and thiourea decreased the overpotential of hydrogen discharge at lower concentrations. On the other hand, β-naphthoquinoline and N-ethyl quinolium iodide increased the overpotential, but gave rise to the lower limit of currents at higher concentrations in 0.1
N HCl solution.
The results would be explained by the strong adsorption of these compounds on the nickel cathode surface.
Comparative study was made on the inhibitor action in terms of the increase or decrease of over-voltage (Δ
E) due to the addition agents in the electrodeposition of nickel.
The increase of Δ
E was observed with the increase of current density by the addition of disodium 1.5-naphthalene sulfonate, thiourea, or coumarin (conc. of 2m M/
l), but the decrease of Δ
E was observed by the addition of butynediol under the same conditions.
The addition of saccharin gave no change of Δ
E at the current density of 0.5-50mA/cm
2.
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