The growth process of oxide layers in the initial oxidation of 80Ni–20Cr alloy has been studied in the temperature range from 500 to 1000°C in air by means of electron diffraction and X-ray microanalysis.
The oxide film formed in a quite early stage (e.g. at 600°C for 1 min) was found to have a NiO structure, while the amount of Cr in the film was twice as much as that of Ni. By annealing of the stripped oxide film the electron diffraction pattern was changed to sharp strong patterns of Cr
2O
3 containing NiCr
2O
4 and NiO.
X-ray microanalysis of oxide films formed at 600°C for 1∼1080 min showed that the Cr content in the oxide layer increased with oxidation time, whereas the Ni content remained constant.
From the present results the following growth process can be constructed. At the beginning of oxidation, this alloy is oxidized at the alloy composition of 80Ni–20Cr. The oxide crystal structure is of NiO. The Cr content in the oxide film increases by preferential oxidation of Cr at the inner oxide layer during the oxidation. Consequently, the concentration gradient of Cr is built up in the oxide layer, from the composition of NiO at the outer layer to the composition close to Cr
2O
3 at the inner layer. Due to the epitaxial relationship with the outer NiO structure, the oxide continues to be of NiO structure despite an increase in the Cr content at the inner layer. As the oxidation continues, a continuous layer of stable corundum type Cr
2O
3 is formed at the inner layer. Then, the Cr
2O
3 layer acts as protective for oxidation and oxidation rate is controlled by diffusion of Cr through the Cr
2O
3 layer.
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