成形加工
Online ISSN : 1883-7417
Print ISSN : 0915-4027
ISSN-L : 0915-4027
15 巻, 6 号
選択された号の論文の19件中1~19を表示しています
目次
巻頭言
解説 : 特集 超臨界流体技術と応用技術
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技術報告
日本の大学・試験・研究機関の研究 : 118
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製品・技術紹介
論文
  • 今泉 光博, 沖野 義郎, 吉川 克行, 小山 清人
    2003 年 15 巻 6 号 p. 419-423
    発行日: 2003/06/20
    公開日: 2009/11/18
    ジャーナル フリー
    As biodegradable plastics have been receiving a great deal of attention from industry from an ecological view point, a number of plastics with biodegradability have been developed over the years. Biodegradable aliphatic polyesters of high molecular weight, consisting of dihydric alcohols and dicarboxylic acids (Bionolle), have been developed by Showa High Polymer Co. They show excellent biodegradability and mechanical properties. In this study, two types of Bionolle were selected: poly (butylene succinate) homopolymer (PBS) and poly (butylene succinate-co-butylene adipate) copolymer (PBSA). Intrinsic viscosity [η] as a function of molecular weight of PBS and PBSA were evaluated by means of low angle laser light scattering with size exclusion chromatography (SEC-LALLS) and viscometry with SEC (SEC-VISCO). The relationships between [η] and Mw for PBS and PBSA in chloroform at 40°C were: [η](PBS)=2.75×10-4M0.75 and [η](PBSA)=7.12×10-4M0.68 respectively, where [η] is obtained in dl/g
  • 第4報 エポキシ樹脂の界面の破壊モデルによる応力-ひずみ解析
    福永 守高, 山田 敏郎, 北 健太郎, 蒲生 正浩, 加納 重義
    2003 年 15 巻 6 号 p. 424-428
    発行日: 2003/06/20
    公開日: 2009/11/18
    ジャーナル フリー
    Our previous report proposed a gradual adhesion model for the interface of epoxy resin used as an electric insulator. The model can deal with the flow and gelling of epoxy resin but it cannot deal with the fracture of the interface. In order to solve the fracture problem, two new fracture models are proposed for the epoxy resin interface.
    1) One model proposes that partial adhesion remains after the fracture of the interface of epoxy resin occurs. The calculated strain change using this model does not give good agreement with experimental values.
    2) Another model proposes that partial adhesion remains after the shrinkage strain from the curing reaction is released by the fracture of the interface. The calculated strain change from this model gives good agreement with experimental values.
    These results indicate that the weak adhesion region breaks away when the fracture of the epoxy resin interface occurs. The temperature distribution of the epoxy resin during the curing reaction does not change with the fracture of the interface. The internal stress of the epoxy resin goes up with the adhesion and goes down with the fracture of the epoxy resin interface.
  • 戴 亜輝, 折原 勝男, 倉本 憲幸, 野村 隆
    2003 年 15 巻 6 号 p. 429-434
    発行日: 2003/06/20
    公開日: 2009/11/18
    ジャーナル フリー
    Self-assembly by full scale phase separation (FSPS) of a polymer blend was investigated as a means of creating a graded structure across the thickness of a film for a polymer blend containing the conductive polymer poly (aniline) (PANT). A graded structure was easily obtained by casting a solution of a polymer blend of PANT and poly (styrene) (PS). After doping the cast films with HCL, the electrical conductivity of the top of the films was found to increase significantly with a very small PANT content while the bottom of the film retained its high resistivity.
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