In this study, the effect of addition of ethylen-vinyl acetate copolymer (EVA) and ethylen-ethyle acrylate copolymer (EEA) on impact strength of poly(vinyl chloride) (PVC)/chlorinated polyethylene (CPE)/calcium carbonate (CaCO3) composite was investigated.The composites were prepared using mixing roll.A maximal impacts trength of PVC/CaCO3 system was obtained with CaCO3 particle content at 30phr.The impact strength of PVC/CPE/CaCO3 (30phr) system was almost constant in CPE between 0 and 7phr and increased gradually beyond 8phr.The impact strength of PVC/CPE(7phr)/CaC03(30phr) system was improved dramatically when EVA and EEA were added, at 3 and 1phr, respectively.The interaction between EVA or EEA and CaCO3 particles was confirmed by dynamic mechanical analysis of EVA/CaCO3 and EEA/CaCO3 system.The interation of EVA/CaCO3 system was stronger than that of EEA/CaCO3 asystem.Itwas suggested that EVA and EEA influenced the dispersion state of CPE particles.

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A new form of dismantlable adhesisve technology has been developed.This is a revolutionary development in the construction industry, which makes it possible for the bonded compound of building materials to be separated by the simple application of heat after use and therefore to be adapted to recycling.Heating over 100 causes the adhesive polymer to soften, and at the same time thethermally expansive particles expand, resulting in loss of bond strength and thus enabling their easy separation.This article describes the dismantlement behavior of joints having the adherendsof steel plate and plaster board, plastic film and wooden board.At the emulsion type dismantlable adhesive, the weight fraction of thermally expansive particles from 5 to 20% is suitable for both bond strength and dismantlement.The bond strength of joints could not decrease after durability test at 60℃-95%RH for 30days, and then it was separated easily by infrared rays heating at 150-180℃ for 2 minutes.At this technology, manufacturing is equal to conventional adhesives, and time of heating for dismantlement is quite short, so that it is efficient for not only performance(adhesive and dismantlement), but also manufacturing and cost.

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Composite films composed of a polyimide, an epoxy resin and a silver filler were prepared.Adhesion strength of the composite film used as an adhesive film between silicon chips and alloy 42 or copper lead frames was studied at high temperature.The adhesion strength of the composite film to each lead frame increased with increasing content of the epoxy resin as well as the silver filler.However, the adhesion strength conversely decreased when the content of the epoxy resin and the silver filler exceeded certain values.Two different failure modes of the adhesive specimen were observed; one was the cohesive failure of the composite film itself and the other was the interfacial failure between the composite film and the silicon chip or the lead frames.It was found that the adhesion strength and the failure mode changed depending on the kind of lead frame and the moisture exposure conditions.In this paper, the relationship between the adhesion behaviors and the bulk and surface properties of the composite film will be discussed.

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