The current epoxy resin-based paste bonding adhesives have some problems in fabricating stacked integrated circuits. In an attempt to solve the problems and to simplify the fabricating procedure, the novel dual-curable pressure-sensitive bonding tape consisting of UV-curable pressure sensitive adhesive (PSA) and thermally curable epoxy resin was investigated. An UV-curable PSA was composed of an acrylic copolymer and UV-curable resin. Excess addition of UV-curable resin and exposure of UV light resulted in poor adhesion. There are two major factors for better compatibility and suitable properties. One is the incorporation of glycidylmethacrylate into the copolymer, and the other is addition of a novolak type epoxy resin. It was ascertained that the newly developed pressure-sensitive bonding tape possesses the performances both of the commercially available dicing tape and the epoxy paste-bonding agent.

View full abstract

In order to apply to the one liquid type blocking adhesive, it was tried to microencapsulate the hardening agent for epoxy resin with epoxy resin by the interfacial hardening reaction method.In the experiment, the reaction time, the concentration of epoxy resin as the shell material and the impeller speed during the microencapsulation process were changed stepwise.It was investigated how these experimental conditions affect the structure, the gelation time and storage stability of microcapsules.It is found that the size, the content of hardening agent and the shell thickness of microcapsules could be controlled by changing the reaction time, the concentration of epoxy resin and the impeller speed.As a result, the storage stability and the gelation time of microcapsules were able to be changed widely.

View full abstract

The damping properties and the adhesive properties of carboxyl-terminated butadiene acrylonitrilerubber (CTBN)/epoxy polymer alloys were evaluated.CTBN/diglycerol polyglycidyl ether (DGPGE) alloy resin including 30wt% CTBN showed micro-phase separated morphology with rubber-rich continuous phases and epoxy-rich dispersed phases.The composite loss factor (η) for a steel laminate, which consisted of two steel plates with the CTBN/epoxy alloy resin layer in between, depended heavily on the environmental temperature and the resonant frequencies. Also, both shear adhesive strength and peel adhesive strength of the resin to aluminum substrates were marginal, which would originate in the low strength and elongation capacity of the CTBN/DGPGE alloy.In the meantime, CTBN/diglycidyl ether of bisphenol-A (DGEBA) alloy resin including 60wt% CTBN did not indicate clear micro-phase separation in nano-scale, which would mean the components had excellent miscibility. The CTBN/DGEBA cured resin had high tanσ in broad temperature range, which resulted in the high loss factor （η＞0.1） for the steel laminate in broad temperature range and several resonant frequencies. The temperature dependence of η and the order of η among resin formulations could be explained, according to the theory proposed by Ross, Unger, and Kerwin. The high peel-adhesive strengths of the CTBN/DGEBA alloy resin would originate in the high energy absorption capacity of the bulk rosin.

View full abstract