The surface treatment of glass fiber using silane coupling agents having di- or tri alkoxy group was carried out. The organic functional group was mercapto group. The glass fiber was dipped in the 0.2-1.0 wt% 2-propanol solution of silane and 2-propanol was evaporated at room temperature, and then heated. The amount of adsorbed silane increased with the concentration of solution. The morphology of silane-treated layer was observed usinga scanning electron microscopy. The surface was seemed to be covered with silane. However, the spherical agglomerates of silane were observed on the treated layer for the dialkoxy structure. The molecular mobility of treated layer was analyzed using a 1H pulse nuclear magnetic resonance. The relaxation time measured for the surface layer was longer for the dialkoxy structure than the trialkoxy structure. It was found that the silane chain was flexible for the dialkoxy structure, where as it was rigid for the trialkoxy structure independent of the amount of adsorbed silane.

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Interfacial microstructure of a double-layer Cu film, composed of an under-layer deposited on SiO2 in Ar-10vol% O2 followed by an upper layer deposited in pure Ar, was investigated for thin film conductor tracks for large and high-definition liquid crystal displays. Thee layer deposited in Ar-10vol% O2 has fine-grain, and contains Cu and Cu2O. Detailed analysis shows the interface between the under layer and SiO2 substrate isn't flat, but concavity and convexity. Addition of oxygen to the discharge gas generates Cu2O in the under-layer. Cu2O dissolves in the SiO2 and forms CuO-SiO2 eutectic. The dissolution of Cu2O in SiO2 must increase anchor effect and the adhesive strength.

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Lignin is the abundant woody biomass next to (hemi)cellulose and is degraded to a specific dibasic acid, 2-pyrone-4,6-dicarboxylic acid: PDC, as a metabolic intermediate. In the present paper, the tensile adhesive strength of PDC-epoxy adhesives was studied. Relationships among curing temperature, species of curing agents, and tensile adhesive strengths of the PDC-epoxy adhesives were estimated. These values were compared to those of similar epoxy monomer of isophthalic acid, IPA, carrying a benzene ring instead of a 2-pyrone pseudo-aromatic ring of PDC as a reference. When succinic anhydride or 4-methylhexahydro-phthalic acid anhydride was used as curing agent, the PDC-epoxy adhesives exhibited larger tensile adhesive strength than IPA-epoxy adhesives at relatively low curing temperature of 130 °C. However, this situation is vice versa at elevated temperature. The tendency of the PDC-epoxy adhesive with pyromellitic anhydride was similar to the corresponding IPA-epoxy adhesive, the tensile adhesive strength became larger with increasing the curing temperature. By contrast, the PDC-epoxy adhesive with maleic anhydride exhibited the opposite tendency, i.e., the curing temperature increment caused smaller tensile adhesive strength. Against the plastics, the PDC-epoxy adhesives adhered polar materials, such as polycarbonate or polyamide. These characteristics might be derived from the polar nature of the 2-pyrone ring in PDC nucleus.

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