For the prevention of the occurrence of "shoot rot disorder" of tea plants, the effects of the foliar spray of Cu(OH)
2 solution and soil application of CuSO4•5H
2O which had been done after plucking of 1st and 2nd crops were investigated at the 2nd and 3rd crop seasons.
1. Few effects of the protection from the occurrence of the "leaf tip necrosis" leaves were re cognized at the 2nd crop, but the occurrence of the "leaf tip necrosis" leaves somewhat decreased only in Cu(OH)
2 foliar spray plots of Sayamakaori. However, the yields of cultivars Yabukita or Sayamakaori after Cu application were about twice that of control plots. Effects of the Cu(OH)
2 foliar sprays were remarkable at the 3rd crop, that is the "leaf tip necrosis" leaf was not observed in the plots of cultivar Sayamakaori.
2. The 0.1 N HC1 soluble Cu content of the soils at the plucking time of 2nd or 3rd crop was highest in the CuSO
4•5H
2O applied plots, followed by the Cu(OH)
2 foliar sprayed plots, and lowest in the control plots. And, the 0.1 N HC1 soluble Cu content in the compost applied plots were lower than that of the unapplied plots.
3. Cu content of the 2nd or 3rd flush shoots in the compost applied plots were lower than that of the unapplied plots, and the formers were 1/3 the latters in control plots. But Cu content in compost applied plots increased after Cu applications, and was 2/3 to that in the compost unapplied plots after Cu(OH)
2 foliar spray.
4. The significant correlations between the percentage of "leaf tip necrosis" leaves and the Cu content in the flush shoots at 2nd or 3rd crop were recognized, but no significant correlations between the 0.1 N HC1 soluble Cu content of the solis and percentage or the Cu content of the flush shoots were recognized.
5. From the results mentioned above, it was considered that Cu application was effective for the protection from the occurrence of the "shoot rot disorder" of tea plants, and the foliar spray of Cu(OH)
2 solution was more quickly effective than the soil application of CuSO
4•5H
20.
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