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堤 一郎, 新井 俊雄
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発行日: 2007/03/15
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Railway industrial heritages remain in the Tochigi Prefecture constructed by the Nippon Railway Company and their significance on the history of technology will be introduced in our report. This private railway was constructed by the peers and ex-samurai classes on 1882. In this report, next five contents will be explained. 1) Brick-made oil storages and brick laying method. 2) Constructional standards on the Brick-made oil storages. 3) Constructed time of the Brick-made oil storages. 4) External appearance and structure on the Brick-made oil storages. 5) Significance on the history of technology of the Brick made oil storages.
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松本 陽, 綱島 均
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In recent years not small numbers of serious accidents happened in transportation systems, for example, significant railway disasters, critical aircraft incidents, accidents of defective automobiles and a fatal accident of elevator. In order to decrease such accidents Japan Society of Mechanical Engineers constituted the task force for high safety transportation systems last year and went into action. The task force consists of specialists of various kinds of transportation fields, and joins together experiences and lessons in each transportation field.
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中村 隆宏
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発行日: 2007/03/15
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Human errors are not unusual characters to be inherent in the specific individuals or environments, and they are certain results influenced by each occasion and situation. Strictly, the characteristics of human reliability, accuracy, vitality, and so on, always changes, so our any acts might to become errors depending on the circumstances. To attempt the accident prevention measures caused by human errors, it is necessary to grasp the process of the accident-occurrence in detail. Especially, what relation the human factors had had among the various accidents causes, and how the psychological condition of victim had been, should be considered carefully. In this research, four labour accident-cases are extracted from 191 accident-cases which occurred in 2000 in Japanese construction work. And the relations among the psychological factors of victims, the processes of the accident-occurrence, and error factors are discussed, including the supposition of the researcher.
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濱島 京子, 梅崎 重夫, 江川 義之
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発行日: 2007/03/15
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In machine maintenance etc, it is necessary for workers to communicate with each other the information about the accident and the condition of machines, and about the presence areas of themselves. In addition, the operation manual and the task risk is the important information highly required for the workers to perform the tasks safely. Although the communication error becomes one of the cause of an accident, it is not recognized as a risk in the risk assessment method. However, it is evident that 64.3% cases of the fatal accidents are caused by accidents related to communication error according to the analysis to 129 cases of fatal accidents of caused by industrial machines. In this paper, the necessity of recognizing the communication error as risk factors is discussed, and the communication system for workers is proposed as a risk reduction method.
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大木 成文, 茂瀬 亮太, 小林 尚登
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発行日: 2007/03/15
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This research proposes a voice controlled security system. Generally, voice recognition is more user-friendly rather than conventional biometric or PIN input security systems. However, "speaker dependent speech recognition" is still not so well functioning. Thus, we propose a system consists of "speaker independent speech recognition" and a supplemental authentication scheme.
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皆川 浩一, M Ridha, 天谷 賢治, 青木 繁
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An inverse problem is analyzed where corrosion of rebars in a reinforced concrete structure is detected from a small number of potential date measured at the surface of the concrete structure. In the inverse analysis, the multi-step genetic algorithm is used in which the fitness is evaluated by the boundary element method. It is shown by a simulation that the net elements, which were introduced for corrosion analysis of net structures, are successfully employed in the inverse analysis.
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清水 尚憲, 梅崎 重夫
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発行日: 2007/03/15
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梅崎 重夫, 清水 尚憲
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There are many hazardous operations executed in large production lines of power press such as the operation of trouble-shooting, maintenance etc. An operator enters in its line for these operations while a machine is stopped. In this case, when other operator restarts the machine by mistake, the accidental start of the machine could cause a serious disaster. A new hierarchical indirect monitoring system for large-scale power press using RFID and countergate was proposed in this study.
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齋藤 剛, 池田 博康, 山田 陽滋, 小野 栄一, 松本 治, 本間 敬子, 李 英雄, 市川 和宏, 金平 徳之, 鈴木 利明, 小林 ...
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A risk assessment for "Toilet-Assist", which is an excretion care support robot, is necessary to its design, but it is difficult to evaluate new risks of this machine. This risk assessment is attempted to compare this machine with an electric toilet seat lift and an automated guided vehicle based on the hazards list of the risk assessment standard. As a result, structural characteristics of protective measures for this machine are clarified.
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福田 豊, 瀬之口 敦
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This paper describes the conflict alert function of Radar Data Processing System (RDP). The conflict alert function shows alert information on a radar display when it detects an event that some aircraft are closing each other as loss of separation minima. The outline of conflict detection method on RDP is explained. Research and development on the conflict alert using downlinked FMS (Flight Management System) data are discussed. Simulation result shows that vertical prediction error is reduced to 80% with FMS vertical velocity and smoothing algorithm, compared with radar data. Horizontal prediction error is also reduced to 70% with FMS ground speed and track angle.
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藤田 雅人
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The conventional surveillance of aircraft flying on the oceanic routes, HF communication, is making the transition to Automatic Dependent Surveillance (ADS-C). In the environment of ADS-C, Air Traffic Control (ATC) authorities use the position information transmitted from the onboard system of aircraft automatically. In order to estimate the collision risk of aircraft flying on the oceanic routes quantitatively, we are analyzing the ADS messages transmitted from aircraft and ATC. In this paper, we introduce the methodology of analysis and its results.
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天井 治
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発行日: 2007/03/15
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Estimating optimal route spacing between parallel arrival routes for Area Navigation (RNAV) operation is required. It's necessary to estimate lateral overlap probability, which is one of the_ most important parameters of collision risk model, for estimating the route spacing. For estimating the lateral overlap probability, a distribution of cross track deviations was estimated using the radar data of Kagoshima Airport, flight plan data and flight strips.The results obtained are as follows. (1) The standard deviation of the observed cross track deviations of 2,298 flights is 0.077NM. (2) The best fitted model for the empirical cross track deviations is Normal(Gaussian)-normal (N-N) model. The fitted parameters are α=0.117, σ_1=0.0673NM and σ_2=0.129NM.
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加来 信之
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発行日: 2007/03/15
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When an aircraft flies, two vortexes called wake turbulence occur from each wing tip. If another aircraft enters into these vortexes, it could crash in the worst case scenario. For the safety of the succeeding aircraft, ATC procedures concerning wake turbulence regulates the separation between the leading aircraft and succeeding aircraft. Unfortunately, with this procedures, takeoff waiting time is longer than without. If wake turbulence can be reliably detected, takeoff separation time can be shortened while maintaining safety, in addition, airport capacity can be increased. ENRI developed a laser wake turbulence detection system. At Sendai Airport, we are observing the wake turbulence of aircraft as they take off.
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福田 一仁, 古沢 利明, 辻 新次
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発行日: 2007/03/15
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The surface modification which performed quenching, tempering, aluminum film deposition, diffusion, and nitriding to the tool steel alloy SKD4 is attempted for the extraction of anti wear properties. The adhesive wear test with SiC ball are conducted The main results areas follow: Best surface modified condition which show the highest plunging. pressure to friction velocity value is 1.8μm of aluminum film thickness and 35mol% of surface aluminum concentration.
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那須 裕規, 佐藤 建吉
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The effects of magnetic field on fretting wear of ferromagnetic materials were evaluated from observations of the worn surfaces and measurements of wear volumes. The tests were carried out in the sphere/plate contact at applied load of 20 to 46N. Steel sphere specimens (φ19.05mm) were fretted at the conditions of slip amplitude of 32μm and slip frequencies of 10 to 150Hz. Two levels of magnetic fields of 0.08 and 0.22T were generated using DC solenoids. The experimental results showed that fretted annular increased in the magnetic field on the low frequency in comparison with on the high frequency. This is due to the effects of the time dependency for the oxidation of frequency and the chemical (or oxidation) activity on wear under a magnetic field. That is, oxidized wear particles attracted by the magnetic field play roll abrasive action in lower frequency. The action should be accelerated by a change of contact pressure distribution in lower frequency.
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在原 健太朗, 高橋 秀雄, 高橋 美喜男
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発行日: 2007/03/15
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Many factors have effect on load carrying characteristics of a spur gear pair. One of them is the lubricating oil. In especial, the temperature in oil is the most important item, because high temperature in oil causes decrease in viscosity and degradation chemical action of additives. The temperature in oil has a relation to the bulk temperature of gear. Therefore, the effect of each condition, such as the transmitting torque, the rotational speed of gear and the height of oil level, on the bulk temperature of gear was investigated. Each condition was investigated by using the testing equipment that is a power circulating type. As a result, the effects of operational conditions were found. The bulk temperature of spur gears in oil bath and various other conditions were discussed.
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是永 敦, 佐々木 信也, 安藤 泰久
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発行日: 2007/03/15
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Journal bearing is also used for small bearing such as a hard disk drive unit; however it has problems that stiffness and friction torque change with changing temperature. In order to expand the application of journal bearing, development of journal bearing which can correspond to severe difference-of-temperature conditions. The journal bearing which can obtain high load capacity with low friction torque was devised by controlling the viscosity by the external electric field using liquid crystal as a lubricating fluid. The objective of this paper is to clarify the influence of applying voltage on journal center position, friction torque, and pressure distribution, and to indicate the design of LC journal bearing. The method of applying voltage partially using distributed electrodes was proposed for the purpose of increasing load capacity with suppressing the increase of friction torque. We clarified that the same load capacity can be obtained with friction torque reduced maximum of 45% compare with conventional bearings.
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佐宗 めぐみ, 三宅 晃司, 高木 秀樹, 前田 龍太郎, 佐々木 信也
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Evaluation of mechanical properties of the thin film is very important to MEMS process, because it is well known that miniaturization of materials, such as nano particles, nano dots, etc., induces the characteristic physical and chemical properties, which are different from those of bulk materials. The mechanical properties of thin films were evaluated by laser-induced surface acoustic wave method (SAW method). We also used nanoindentation method in order to verify the validity of the results obtained by SAW method. The results indicate that SAW method is same level of accuracy of nanoindentation method.
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平岡 尚文, 斉藤 伸彰, 有賀 義文
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Friction and wear tests of DLC and sintered-carbon sliding pairs were carried out. DLC indicated high friction coefficient compared with that of non-DLC materials. Transferred carbon films were observed on some places of tested DLC surfaces and friction on these films was found to be larger than that on no-transfer-film areas. There were some peaks of roughness on DLC surface, which were not observed on non-DLC material's surface. High friction of DLC could be attributable to these partially transferred films or peaks on DLC surface.
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鳥羽 啓太, 吉本 成香, 宮武 正明
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発行日: 2007/03/15
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In recent years, the Vacuum Chuck has been usually used due to holding manufactured products, carrying parts and so on. Of them, the Vacuum Chuck utilizing the porous material is characterized by holding objects of various sizes and not bending them. However, holding characteristics of the porous vacuum chuck has hardly been reported. In this paper, the holding characteristics of the porous vacuum chuck are investigated theoretically and experimentally.
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野口 昭治, 長崎 廣太
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発行日: 2007/03/15
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The roller chain is widely used as power transmission element on machines such as motorcycles and transporting machines. In this research, we used FEM analysis to examine the stress distribution of chain when load applied, and analyzed several chain models which attain lighter weight.
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野口 昭治, 三河 槙
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発行日: 2007/03/15
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Currently, the primary oils used as industrial lubricating agents are mineral oil and chemical synthetic oils. The disposal of these oils are generates carbon dioxide and harmful substances which contributes to global warming and serious environmental pollution. In this research, various edible oils are used as lubricating agents and examined for friction and wear-out characteristics. The results of the tests were compared to the results of mineral oils tested under the same conditions. The research found that colza, sesame, and econa oils had an equivalent effect to the mineral oil tested. Furthermore, component analysis found these edible oils contained a significant amount of oleic acids.
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上野 和良
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発行日: 2007/03/15
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Large scale integrated circuit (LSI) is expected to be improved according to "Moore's Law" until 2020. In order to keep this trend, it is necessary to scale down interconnect pitches with introducing new materials such as low-dielectric constant (low-k) dielectrics to reduce interconnect delay. However, it becomes challenging to fabricate scaled interconnects with low-k dielectrics due to its lower mechnical strength. Mechanical engineering will play an important role in developing future interconnect systems, such as stress analysis of Cu/low-k interconnect structure to obtain sufficient yield and reliability.
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吉田 知弘, 加藤 初弘
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発行日: 2007/03/15
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The ULSI is a composite system made from many materials and the stress is generated caused by the mismatch of the thermal expansion. The reliability issue related with the thermal stress is mainly discussed about the thermal history of the fabrication processes. However, the global bus line is facing a new mode of failure during operation because of the increased thermal power at high speed operation and the reduced strength of low-k dielectric material. It has been pointed out that attention should be paid to thermal stress in designing the floor plan of the global bus lines.
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下山 正, 望月 宣宏, 檜山 浩國, 辻村 学
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発行日: 2007/03/15
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The effect of processing variation in CMP on effective dielectric constant (k_<eff>) of interconnect was estimated by calculation. The target structure was a hybrid type for 45nm technology node. The wiring capacitance (C) and k_<eff> were calculated by electrostatic field analysis using the finite element method. In addition, the effect on wiring resistance (R) and RC value were evaluated. The ratio of change in each electric parameter in case of polishing variations at ±5nm and ±10nm were compared with the case of the designed structure. The results indicated that the k_<eff> was relatively insensitive to the variations in CMP, while R was most sensitive. However, when the dielectric constant of the hard mask was set as high as the value of the current hard mask, the effect on k_<eff> was drastically increased. These results suggest that the processing accuracy of CMP will be even more important in the future.
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近藤 英一, 廣瀬 みちる, 有賀 庄作
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発行日: 2007/03/15
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A supercritical fluid is a high-pressure medium that possesses unique features such as solvent ability and nano penetration capability. Using supercritical CO_2 fluids as a medium for thin film deposition provides excellent gap-filling and step-coverage possibilities. Lacking of the information of pros and cons and deposition characteristics exists due to the novelty of this technique. One of the reasons for that is no presence of deposition tools sophisticated as much as existing deposition techniques such as CVD. We have developed a flow-type deposition tool that enables continuous supply of a metal precursor with fixing the deposition parameters. This paper reports the development of a "full fluid"-type deposition processor that aids to carry out furthermore precise deposition experiments.
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室伏 正, 神保 雅一, 平山 浩, 臼井 孝公, 柴田 英毅
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発行日: 2007/03/15
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Deformation of Copper (Cu) interconnects with various bind of gaps during thermal treatment such as annealing at 350℃ were investigated using the finite element analysis method. It is found that Cu interconnects with air gaps at infra-level is susceptible in terms of the thermal expansion. In addition, dummy Cu metals and its optimized arrangement at each Cu interconnect layers would be essential in order to avoid the deformation of Low-k dielectric at via layer in the large area without Cu interconnects.
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福田 明, 望月 宣宏, 檜山 浩國, 辻村 学
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発行日: 2007/03/15
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We simulated stress in inter-metal dielectrics at tungsten CMP process by finite element method analysis. We found that the stress in inter-metal dielectrics after releasing of residual stress of tungsten film was about 100 times larger than the stress to act by CMP. Consequently, it was very likely that the releasing of residual stress of tungsten film by CMP causes the failure of inter-metal dielectrics being observed after CMP. Therefore, reducing defect in inter-metal dielectrics and decreasing residual stress of tungsten film are important for preventing failure of inter-metal dielectrics.
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倉科 敬一, 中田 勉, 辻村 学
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A new copper interconnect plating process which uses a porous pad with enormous fine through-holes is proposed and examined. Plating with the pad pushed on a wafer surface provides a flat overburden copper film with a lot of tiny posts on a patterned structure. These posts can be removed very easily by chemical etching, and there remains only a flat and minimum overburden copper film without any posts. This copper film can be polished easily and shortly by CMP, and results in a good step property.
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嶋 昇平, 福永 明, 辻村 学
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発行日: 2007/03/15
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In-situ potentiodaynamic polarization and open circuit potential evaluation were performed for copper in CMP chemicals. Electrochemical reaction is markedly dependent on CMP chemicals, such as oxidizer, inhibitor, and chelate agents. This is due to the difference in surface chemical reactions (anodic and cathodic) and the formation of surface passivation layer. Low density passivation layer evaluated from AFM force curve grows on copper surface in H2O2 oxidizer. In APS oxidizer, there is no passivation layer on copper. The suppression of anodic reaction in polarization and distinct changes in open circuit potential are clearly observed in BTA inhibitor. This means BTA molecules adsorbs on copper immediately and forms passivation layer, however this layer is not dense. More denser passivation layer grows in chelate agents, such as quinaldic acid and glycine.
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木村 景一, 永山 勝也
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発行日: 2007/03/15
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VLSI manufacturing process is composed of more than some hundreds processes from Si ingot formation to chip packaging. In every process, Mechanical Eingineering has close relationship with them. Particularly, CMP (Chemical Machanical Polishing) for planarization process, built up on the basis of ultra-precision polishing technology, is essential process for VLSI manufacturing. As an attempt on CMP process research, slurry flow between wafer and polishing pad was investigated with computer analysis and visualized experiments. Basically, slurry flows under the influence of wafer and polishong pad motion, and moreover, grooves on the polishing pad is possible to control the flow of slurry. It suggests that polishing performance is controllable with grooves pattern, and a lodester on optimum grooves pattern design was found.
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小畠 厳貴, 和田 雄高, 徳重 克彦, 福永 明, 辻村 学, 當間 康, 鈴木 作, 小寺 章
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発行日: 2007/03/15
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Polishing performances of mC^2 (low down force CMP), ECP-DI (Electro-Chemical Polishing in DI water) and ECP-C (Electro-Chemical Polishing in Chemical) are compared as a candidate of planarization technology for the next generation. Each planarization technology shows high removal rate under the low down force condition and excellent planarization performance. However, Dishing increases rapidly in ECP-DI and ECP-C after Cu Clear because of electro-chemical etching. In our experimental data, mC^2 is superior to ECP-DI and ECP-C for polishing performance. In addition, ECP-DI has large advantage for CoC, because ECP-DI doesn't basically use any chemical.
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橋山 雄一, 木村 景一, カチョーンルンルアン パナート
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発行日: 2007/03/15
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The material removal mechanism on Chemical Mechanical Polishing is not clarified yet. Accordingly, it is difficult to build up a systematic CMP process simulation system. In order to develop CMP process simulation system, it is necessary to establish "material removal model" among wafer surface, polishing pad surface and fine particles in slurry. In the study, we are proposing material removal model for SiO_2 layer. Chemical adsorption between fine particles and wafer and between fine particles and polishing pad is an important factor for the material removal mechanism.
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石井 遊, 徳重 克彦, 辻村 学
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It experiments on the influence that the geometry of CMP pad (depth of groove, presence of sub-pad) gives to planarity and wafer edge polish profile. The validity of the experiment is verified by the simulation. (1) The grooved pad makes planarity worse. To improve planarity, it is effective to remove the sub-pad. There is a correlation between the experiment and simulation. (2) The difference is seen about the polish profile of the wafer edge between a simulation and real polish. It is thought that Wafer Edge Roll-Off is a cause of the difference.
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清水 優, 井上 全人, 石川 晴雄, 中野 禅, 王 清
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発行日: 2007/03/15
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Recently, thin film or surface type devices have been developed for MEMS and others. In the development of the devices, residual stress in the film or surface influences the properties of the devices. For the estimation of the residual stress, a new method using nano-indentation test is proposed. The experimental results prove the usefulness of the new method.
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大田 真朗, 辻村 学
原稿種別: 本文
セッションID: 21714
発行日: 2007/03/15
公開日: 2017/06/19
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EndPoint Monitor (EPM) of polishing is one of the key technology of CMP. As semiconductor devices scale down, the requirement to oxide CMP process will become higher. On the other hand, the removal rate of film at CMP process is easily influenced by small deviation of characteristic of the consumable that will directly affect to CMP process. In addition, there is initial thickness difference of film itself, so it will become more difficult to meet the target thickness of film with fixed time polishing. To solve these issues, this paper describes optical EPM that can monitor the change of film thickness by the method of optical interference and detect endpoint of CMP.
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山口 龍之介, 藤澤 敬浩, 本名 俊輔, 木村 元昭, 宮城 誠徳
原稿種別: 本文
セッションID: 21715
発行日: 2007/03/15
公開日: 2017/06/19
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In late years, micro sensor array to clarify minuteness structure of a flow is demanded as miniaturization of a measurement device advances. We develop micro shear stress sensor that it is for the measurement and control of a flow by this study. Based on silicon, we examine that production process of using metal film or semiconductor film of the micro sensors array. And we made that SOI wefer used micro shear stress sensor prototype in our clean room. We report the summary here.
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小澤 祐介, 何 英, 太田 正廣
原稿種別: 本文
セッションID: 21716
発行日: 2007/03/15
公開日: 2017/06/19
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Varying some types of substrate structure, we measured temperature difference near the Ar^+ laser spot (Φ1[mm]) between front surface on which sputtered carbon film was fabricated and rear surface by thermocouple to compare thermal insulation properties. The point we measured was about 2mm far from laser spot and the diameter of thermocouple is 1.3[μm]. It was cleared that we can gain remarkable insulation effect by inserting air layer between front and rear substrate. Maximum temperature difference on 3-layer substrate (top layer: Glass, second layer: Air, third layer: Polyimide, total: 0.558[mm]) was about 4 times increased than single-layer substrate (top layer: Glass, total: 0.152[mm]). Especially, we could find that effect in average expansion speed of temperature difference (0-1[s])
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諸貫 信行, 金子 新, 内田 和明
原稿種別: 本文
セッションID: 21717
発行日: 2007/03/15
公開日: 2017/06/19
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This study aims to make clear the effect of microstructure design on the wettability and flow directionality. Parallel micro-grooves distort the droplet on it along the pattern because additional energy is necessary to spread across the grooves. The effect of groove design on the directionality was examined based on the experiments. The flow property on the grooves is then examined. The liquid is also easily flow along the grooves. Finally, the applications of the directionality are discussed. This kind of directionality can be used for the design of self-cleaning surface.
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板川 剛, 武居 昌宏, 趙 桐
原稿種別: 本文
セッションID: 21718
発行日: 2007/03/15
公開日: 2017/06/19
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Recently, the semiconductor processing technology is advancing. The development of the semiconductor technology influences in fields other than electronics. With the development of this technology, A lot of Microdevice has been proposed. In a chemical field and the medical treatment field, etc the research of a minute space has been attracted. In this research, The flow of the passage where width is one millimeter was measured. The measuring method used resistance CT. The sample used ferrofluid. The density distribution of ferrofluid was measured by resistance CT method and The image of making to visible was restructured based on the data.
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八木 崇宏, 阿部 豊, 池 昌俊, 藤森 憲
原稿種別: 本文
セッションID: 21719
発行日: 2007/03/15
公開日: 2017/06/19
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The photo resist stripping process in photo lithography plays an important role in manufacturing large-scale integration. In the present study, experimental information is obtained to establish highly concentrated ultra pure ozonized water technology for stripping the photo resist, in stead of sulfuric acid, hydrochloric acid etc. In the experiment, rotating flows of the ozonized water on the photo resist on silicon wafer is established with the irradiation by excimer light. Ozonized water on the rotating wafer forms Radial Liquid-film flow. After the process, the thickness of unremoved photo resist on the wafer is measured by ellipsometer. And wettability on the photo resist is also measured. As the result, it is clarified that the irradiation of excimer light and the rotation of wafer contribute high efficiency of photo resist removal rate compared to merely ozonized water.
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小原 弘道, 黒木 賢治, 松平 晏明
原稿種別: 本文
セッションID: 21720
発行日: 2007/03/15
公開日: 2017/06/19
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Local velocities of micro particles induced with dielectrophoresis (DPE) are measured to investigate fundamental characteristics of the local migration of particles. Dielectrophoresis is the phenomenon of a force induced on micro particles in a non-uniform electric field. It has a great advantage to manipulate micro-nanoscale particles as well as biological cell for biotechnology and nanotechnology. Furthermore, this local particles migration can generate local flow to form intelligent flow field which is useful for novel self-assembled micro fabrication technique and micro fluidics for micro medical and biological implements. In this study, the local velocities of particles are measured with the particle tracking technique in a micro channel. It is confirmed that the local particle velocities depend on the electric field intensity, the frequency and the position of the particle on the non uniform electric field. And the possibility of generating a local flow to form intelligent flow field with the migration of particles is discussed.
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深谷 孝一, 辻村 学
原稿種別: 本文
セッションID: 21721
発行日: 2007/03/15
公開日: 2017/06/19
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This paper describes the Drying method against hydrophobic and hydorophilic films during chemical mechaical polishing (CMP). Spin Rinse Dry (SRD) is general method previously in CMP Drying Process. But for the 65nm node, low-dielectric-constant (low-k) materials are used for the interlayer dielectric (ILD) film and low-k films are Hydrophobic that watermark generation occurs. To suppress the watermark, IPA Dry has been developed. Rotagoni Dry is a kind of the IPA Dry that conbinates Marangoni force and Wf rotation force. We forcus the Rotagoni Dry and investigate thd Drying effect on hydorophobic and hydorophilic films by comparing SRD with IPA Dry.
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原稿種別: 付録等
p.
App16-
発行日: 2007/03/15
公開日: 2017/06/19
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山口 徹, 市田 良夫, 森本 喜隆, 佐藤 隆之介
原稿種別: 本文
セッションID: 21509
発行日: 2007/03/15
公開日: 2017/06/19
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In order to obtain the basic data to clarify the material removal mechanism in the nano-grinding, fundamental experiments to generate the nanoscale grooves of Single-crystal Si has been tried using an Atomic Force Microscope combined with a two-axis capacitive force/displacement transducer. When increasing the normal force, three different regions in the normal force in which the different mechanism of groove formation take places are found. They are an elastic deformation region without remaining deformation, a plastic deformation region in which the groove is dominantly formed by plastic flow and a removal process region in which the groove is dominantly formed by removal process The minimum normal force f_<nR> at which the process begins is about 34.9μN and in this case the groove with a depth of about 0.42nm is formed. The critical normal force f_<nR> is identified from a characteristic change in a ratio of normal and tangential forces with increasing normal force.
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中村 和哉, 市田 良夫, 森本 喜隆, 佐藤 隆之介
原稿種別: 本文
セッションID: 21510
発行日: 2007/03/15
公開日: 2017/06/19
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various studies on groove machining of single-crystal silicon have been done because it is used extensively as semiconductor devices. Micro groove machining is expected as the application for reaction promotion of chemical catalyst to increase material surface area to form micro grooves in material surface. Therefore, groove microfabrication technology of high hardness steel is strongly expected to establish. This machining method is also expected to apply as the new die machining. In this report, the micro groove machining of steel material using cBN blade is realized with accurate groove profile that depth is 100μm. The burr height, karf width and microasperity of groove bottom are evaluated under the various machining conditions.
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中澤 剛晶, 市田 良夫, 森本 喜隆, 佐藤 隆之介
原稿種別: 本文
セッションID: 21511
発行日: 2007/03/15
公開日: 2017/06/19
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Micro fabrication is progressed in the mechanical processing makes the measurement of grinding forces is very difficult. The representative methods of measuring grinding forces synchronizing with the machining are piezo-electric type and the semiconductor strain gauge type dynamometer. However, the measurement of grinding forces becomes difficult because of the noise by the influence of grinding fluid in a traditional dynamometer. As the micro fabrication is expected to improve accuracy, the traditional method putting works on dynamometer is not always suitable for the practical use. We propose a new indirect measurement method by using the gap capacitance sensor which has high accuracy and can neglect the influence of the grinding fluid easily. In this report, the method of measuring the displacement, the relation between displacements and forces, and experimental results are reported.
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