Journal of The Adhesion Society of Japan
Online ISSN : 2187-4816
Print ISSN : 0916-4812
ISSN-L : 0916-4812
Volume 37, Issue 4
Displaying 1-6 of 6 articles from this issue
Review
Review
Review
Short Communication
  • Akira KAWAI, Hiroshi HORIGUTI
    2001 Volume 37 Issue 4 Pages 146-149
    Published: April 01, 2001
    Released on J-STAGE: October 31, 2014
    JOURNAL FREE ACCESS
    Hamaker constant between two solid surfaces is one important physical factor due to van der Waal's interaction. By measuring the adsorption force F[N] to the solid surface with a mico tip (curvature radius of tip apex R[m]). Hamaker constant A[J] can be obtained experimentally. Mean while, based on Lifshitz theory, Hamaker constant A between solid surfaces can be calculated with refractive index n and relative dielectric constant ε of the tip-sample materials. In this study, the positive correlation between two Hamaker constants obtained by these different methods is clearly confirmed. The validity and effectiveness of Hamaker constant analysis by the probe method can be confirmed. The possibility of identification of sample materials by this method is also discussed.
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Original Paper
Original Paper
  • Mitsuhide OCHI, Chikayo KOYAMA, Seiji TANAKA, Kenji MATSUO
    2001 Volume 37 Issue 4 Pages 133-139
    Published: April 01, 2001
    Released on J-STAGE: October 31, 2014
    JOURNAL FREE ACCESS
    We tried to improve the fracture toughness by using an aromatic polyamide resin as a high molecular weight curing agent. With the addition of the aromatic polyamide, the heat stability of the cured epoxy resin increased beyond the additive low and fracture toughness simultaneously increased. It was considered that the improvement of the heat stability was due to the increase in the crosslinking density and the introduction of stiff aramid segment into epoxy networks.The fracture toughness was improved by an increase in the homogeneity of the micro-structure and the pinning effect of the rigid polyamide molecules introduced in the networks as an high molecular weight curing agent.
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