[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

Human monitoring technology will be explained for the improvement of QOL.

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

The authors have proposed a method of producing flexible intelligent sheet devices by weaving the fiber device segments. Inkjet direct printing technology is proposed for producing thin film devices on fiber substrates. This paper reports on a concept of inkjet patterning and film deposition in fiber trenches. Ag ink droplets were deposited in the shallow trenches on the quartz fiber substrates. The Ag ink pattern width was precisely fixed by the trench wall. Laser irrdiation was applied for rapid sintering of metal ink.

View full abstract

We developed fabrication process of a large-area flexible fabric type of touch sensors withi consists of PEDOT PSS-die-coating of 470 um-diameter fibers and their weaving. The developed system allowed the film with the sheet resistance of 4 kohm per square and the traveling speed of 4 m per minute. with established system, 100 m-long fiber was processed and woven, achieving Y-shirts size of fabric sensors. Their sensitivity is also characterized.

View full abstract

[in Japanese]

View full abstract

There are various technical challenges such as increases of IO bandwidth of CPU package, cost, consumption power, and so on, in realizing further ehnancement of the processing power of coumputers. Advanced optical interconect technology is now considered to be one of the essential items in solving the challenges. Requirements and current research status of this technology will be discussed.

View full abstract

[in Japanese]

View full abstract

We propose a flat-passband 1x43 wavelength-selective switch by using a combination of anamorphic prism pairs and two-axis MEMS mirrors. The prototype successfully demonstrates a 1x43 switching with a transmission bandwidth of +/-30 GHz.

View full abstract

As several mirrors should be closely arranged in a MEMS mirror array developed for wavelength selective switches (WSSs), electrical interference can occur between adjacent mirrors. Mirror angle variations caused by electrical interference causes loss changes in the WSS. Therefore, reducing the electrical interference in the mirror array is one of the most important requirements. We designed a new electrode structure to reduce electric interference between adjacent channels. We fabricated a 50-channel mirror array module and confirmed that the module has good characteristics.

View full abstract

[in Japanese]

View full abstract

We studied on a mutual relationship of SWW (Self-Written Waveguide) with several fabricationparameters such as the laser irradiation power and optical mode upon SWW shapes. We simulated SWW shapes using the ray tracing method. Experimentally, we fabricated SWWs under several beam divergence angles. We demonstrated that control of the SWW shape is possible with specific parameters.

View full abstract

[in Japanese]

View full abstract

We represent optical properties and crosstalk of polymer optical waveguideswith graded-index (GI) cores , which we have been developing for enablingboard-level optical interconnection. We have reported that GI cores inpolymer optical waveguides lead to low dispersion as well as low opticalloss and low crosstalk. Specifically, in this report, we will demonstratethe advantage of GI core waveguides in crosstalk both theoretically andexperimentally, compared with conventional SI core waveguides.

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

We have made a probe volume of a blood flow sensor about two hundredth of a conventional sensor by a fusion of SiP (System-in Package) and optical MEMS (microelectromechanical systems) chip. An improvement of fabrication efficiency can be realized, because structures of both SiP and optical MEMS chip enable wafer-level packaging. This newly developed blood flow sensor (SiP-MEMS blood flow sensor) is portable and can measure during moving by the wireless transfer.

View full abstract

[in Japanese]

View full abstract

Negative-tone reaction development patterning was applied to polycarbonates with adamantane structures. The polycarbonate films irradiated through photomask was developed with solution containing tetramethylammonium hydroxide, and the development in the best condition resulted in formation of negative-tone line and space patterns with high sensitivity.

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

Noise reduction of simultaneous switching noise has been investigated by mounting discrete capacitors on the back side of a package substrate, or embedding capacitors inside a laminate package. Power supply impedances for them were compared with each other. Next, a noise generating circuit mounted on the package model in the circuit simulator. Then, the swichingnoises on the power and ground terminal were compared by the simulation.

View full abstract

The present, CMOS circuits are used at electronic machines and move quickly. But CMOS circuits are occured much noise at power and ground when we do swiching,this influence causes problems for example moving wrong and EMI.Especially penetration current of CMOS circuits increase EMI as common mode current.I will report this research that I used CMOS standard logic ICs which can obtain device models and measured analysis of signal wavelength and movement power voltage using HSPICE and pracitical boards and measured power noise wavelength using SPEED2000 and investigated influence of EMI.

View full abstract

In this study, we measured the time variation of electric fields leaked from a heating device in the ion cyclotron range of high-frequency in an experimental fusion facility, and analyzed their statistical characteristics. As a result, we found that the electric field variation with time and the maximum electric field level is very small but the instantaneous field variation is very violent. In addition, we also found that even in the worst case the interference voltage induced in the output of the pacemaker sensing circuit does still not exceed the threshold for a malfunction.

View full abstract

Simultaneous switching noise of FPGA was investigated by both measurementand simulation. First, a precise circuit model was established byextracting the leadframe inductance of the package and including on-chipdecoupling capacitance. The power supply impedance of an evaluation boardwas also simulated. Then, measured waveforms were compared with time-domainsimulated results. The simulated time-domain waveforms showed a goodagreement with measured waveforms. Moreover, ringing frequency of themeasured waveforms was well correlated with the properties of the powersupply impedance.

View full abstract

In this work, a reduction method of SSN and resulting EMI of a printed circuit board (PCB) with a planar electromagnetic bandgap (EBG) structure has been examined.The EBG structure is effective in reducing a specific frequency band in GHz range, however, it cannot suppress the noise in the low frequency range under 1GHz. This work reports on experimental and simulated results for aiming wider stop-band region by placing discrete chip-capacitors in a regular pitch on the PCB along with EBG structure.

View full abstract

[in Japanese]

View full abstract

Power distribution network (PDN) of LSI has become one of important design parameters to reduce simultaneous switching noise for core circuits. For mobile communication and automotive applications, switching current of high-performance CMOS LSIs must be controlled to be low as possible in order to suppress EMI. Therefore, on-chip decoupling capacitors must be properly arranged on a chip to optimize the amount of capacitor and to minimize the occupied area by on-chip capacitor.

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract

[in Japanese]

View full abstract