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hiroshi kawamura, kazushige oki, hiromi kurashima
Session ID: 11B-06
Published: 2010
Released on J-STAGE: July 17, 2014
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Yasushi Yamada, Tsuguo Kondoh, Toshihiko Kikuchi, Hirofumi Hoshina, Ka ...
Session ID: 11B-07
Published: 2010
Released on J-STAGE: July 17, 2014
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Kanji Otsuka, Yutaka Akiyama
Session ID: 11B-08
Published: 2010
Released on J-STAGE: July 17, 2014
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Gradually power integrity for digital circuits is recognized strongly to be important. However, this is not new problem which has been discussing since 1960s. I will try to search the history, and to analyze the technical change for the time span. Consequent the perspective will be made to ideal direction.
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Atsushi Tomishima, Motochika Okano, Toshiyuki Kaneko
Session ID: 11B-09
Published: 2010
Released on J-STAGE: July 17, 2014
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chie sasaki, yoshiyuki saito, eiji takahashi, yasuhiro sugaya, hideki ...
Session ID: 11B-10
Published: 2010
Released on J-STAGE: July 17, 2014
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Chihiro Ueda, Kanji Otsuka
Session ID: 11B-11
Published: 2010
Released on J-STAGE: July 17, 2014
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Unnecessary noise radiation of a low frequency band decreases by using the stacked pair power plane structure from the PCB conventional power plane structure. The characteristic of stacked pair structure is considered from simulation data and actual measurement data.
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Ryohei Yoshitomi, Yoshio Kobayashi, Zhewang Ma
Session ID: 11B-12
Published: 2010
Released on J-STAGE: July 17, 2014
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Katsumata Masaki, Koshiji kohji
Session ID: 11B-13
Published: 2010
Released on J-STAGE: July 17, 2014
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Shogo Kaneko, Yoshio Kobayashi, Ma Zhewang
Session ID: 11B-14
Published: 2010
Released on J-STAGE: July 17, 2014
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Yoshio Kobayashi, S. M. Nazarat Hossain, Zhewang Ma
Session ID: 11B-15
Published: 2010
Released on J-STAGE: July 17, 2014
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Shuhei Wadayama, Yoshio Kobayashi, Zhewang Ma
Session ID: 11B-16
Published: 2010
Released on J-STAGE: July 17, 2014
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Toshihiro Katashita, Akashi Satoh, Katsuya Kikuchi, Hiroshi Nakagawa, ...
Session ID: 11B-17
Published: 2010
Released on J-STAGE: July 17, 2014
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Tatsuya Sakai, Takashi Sakusabe, Takehiro Takahashi, Noboru Schibuya
Session ID: 11B-18
Published: 2010
Released on J-STAGE: July 17, 2014
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Kazunori Futamura, Takahiro Yagi, Satoru Haga
Session ID: 11B-19
Published: 2010
Released on J-STAGE: July 17, 2014
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With low voltage and high current of Electronic Devices in recent years, gain importance for stabilization of power supply plane.This paper conducted a simulation study of structural about low impedance of the power planes in multilayer printed circuit board.
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Kazuya Kumehara, Koichiro Masuda, Kohji Koshiji
Session ID: 11B-20
Published: 2010
Released on J-STAGE: July 17, 2014
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Hiroyuki Motoki, Hideyuki Nakanishi
Session ID: 11B-21
Published: 2010
Released on J-STAGE: July 17, 2014
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Narimasa Takahashi, Yoshiyuki Kosaka
Session ID: 11B-22
Published: 2010
Released on J-STAGE: July 17, 2014
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According to CPU tendency to be high performance, low voltage and large current, optimizing the circuit design and the packaging design is one of the important items in switching power supply system. In this paper, the DC-DC converter substrate that applied the simulation was made and was compared with the measurement result. As the result, it was confirmed that the simulation results about output waveform and radiated noise have correlated with measurement results.
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Tomoya Maekawa, Hideki Iwaki, Toru Yamada, Koichi Ogawa
Session ID: 11B-23
Published: 2010
Released on J-STAGE: July 17, 2014
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Recently, the noise generated from digital circuits leaks into the receiver circuit via an antenna,and this makes the receiver sensitivity deteriorate. To solve this problem, we have developed a novel design method according to the correlation between the magnetic distributions of antenna and noise source, evaluated the validity of the proposal method using the TEG imitating portable telephone. Then, we clarified that a good correlation between the product of the two magnetic distribution and receiving noise can be obtained.
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Tomoo Nishiyama, Hiroyuki Takahashi, Hideyuki Katagi, Naoki Hara, yosh ...
Session ID: 11C-01
Published: 2010
Released on J-STAGE: July 17, 2014
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Yoshihiro Nakamura, Kasumi Ikeba, Masaaki Takekoshi, Shinji Tsuchikawa ...
Session ID: 11C-02
Published: 2010
Released on J-STAGE: July 17, 2014
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Tomohito OGURA, Tomoya HIGASHIHARA, Mitsuru UEDA
Session ID: 11C-03
Published: 2010
Released on J-STAGE: July 17, 2014
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Kentaro Uesugi, Shinji Yoshikawa, Yoshinori Gondoh, Yashuyuki Kimura
Session ID: 11C-04
Published: 2010
Released on J-STAGE: July 17, 2014
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Kenji Iida, Akira Sannomiya, Kotaro Asahina
Session ID: 11C-05
Published: 2010
Released on J-STAGE: July 17, 2014
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Nowadays, thermal interface materials(TIM) are necessary for the LED devices and the power devices because the power of these devices are becoming higher and higher. So we developed "Thermal Conductive Thermoplastic Polyimide",which has high thermal conductivity (5.0W/mK), insulation and adhesive ability, to meet these needs. This new material can complete the bonding process less than 1 hour (The long time curing process isn't necessary!). We will present about the other features of this material in detail.
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Miyuki Harada, Nana Hamaura, Mitsuazu Ochi
Session ID: 11C-06
Published: 2010
Released on J-STAGE: July 17, 2014
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Takayuki Kobayashi, Toshiaki Tanaka, Isao Suzuki
Session ID: 11C-07
Published: 2010
Released on J-STAGE: July 17, 2014
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toshihiro miyake
Session ID: 11C-08
Published: 2010
Released on J-STAGE: July 17, 2014
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From the trend of a control system for cars, I spoke the electronics packaging technology which will become more and more important in future. I spoke necessity of each “small high density packaging” and “the packaging for large electric current” and some examples for “systematization” and “the being electromotive”.
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Yoshiko Takamatsu, Hisao Esaka, kei Shinozuka
Session ID: 11C-09
Published: 2010
Released on J-STAGE: July 17, 2014
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Fumiyoshi Kawashiro, Masaaki Yoshikawa, Hisayuki Tsuruta, Takaki Etou, ...
Session ID: 11C-10
Published: 2010
Released on J-STAGE: July 17, 2014
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Kenichi Yamamoto
Session ID: 11C-11
Published: 2010
Released on J-STAGE: July 17, 2014
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Takao Nogi, Hajime Takagi, Tomoyuki Kitani, Kentaro Suga, Akira Tojo, ...
Session ID: 11C-12
Published: 2010
Released on J-STAGE: July 17, 2014
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Ichiro Koiwa, Takashi Suzuki, Toshio Tamura, Kentaro Koiwa, Yohei Waku ...
Session ID: 11C-13
Published: 2010
Released on J-STAGE: July 17, 2014
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Yasuyuki Yanase, Mayumi Nakasato, Kouichi Saito, Hajime Kobayashi, Ats ...
Session ID: 11C-14
Published: 2010
Released on J-STAGE: July 17, 2014
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Yoshio Mito, Tatsuhiro Koizumi, Tooru Kina
Session ID: 11C-15
Published: 2010
Released on J-STAGE: July 17, 2014
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The 4-sides buttable CdTe-ASIC hybrid module for X-ray Flat Panel Detector(FPD) has been developed by applying Through Silicon Via(TSV) technology to the readout ASIC.The ASIC has 128x256 channels of charge integration type readout circuit having the area of 12.9x25.7mm. The CdTe sensor of 1mm thickness, having the same area and pixel of 100um pitch, was fabricated from the Cl-doped CdTe single crystal grown by Traveling Heater Method(THM).Then the CdTe pixel sensor was hybridized with the ASIC using the bump-bonding technology.We will introduce these technologies.
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Nae Yoneda, Kenya Kawano, Kazuhiko Yamada, Hiroki Hayashi
Session ID: 11C-16
Published: 2010
Released on J-STAGE: July 17, 2014
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We measured and simulated the thermal performance of small-sized thermally enhanced packages which constructed with several type of die bonding materials with different thermal conductivity range of 2 to 80W/m/K. As a result, as for steady-state thermal resistance does not almost depend of the thermal conductivity of adhesive. On the other hand, thermal conductivity of the adhesive and gluing area ratio of the adhesive has significantly influence on the transient temperature rise with instantaneous large heat dissipation.
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Masato Taira, Yuinghui Wang, Jian Lu, Eiji Higurashi, Tadatomo Suga
Session ID: 11C-17
Published: 2010
Released on J-STAGE: July 17, 2014
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Masahisa Fujino, Tadatomo Suga, Ikuo Soga, Daiyu Kondo, Yoshikatu Ishi ...
Session ID: 11C-18
Published: 2010
Released on J-STAGE: July 17, 2014
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Hiroki Maruo, Koji Motomura, Hideki Eifuku, Tadahiko Sakai
Session ID: 11C-19
Published: 2010
Released on J-STAGE: July 17, 2014
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Satoshi Amari, Masao Oshima, Fumihiko Taniguchi, Ken Shono, Takashi Su ...
Session ID: 11C-20
Published: 2010
Released on J-STAGE: July 17, 2014
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Yasuhiro Yamaji, Tokihiko Yokoshima, Noboru Igawa, Katsuya Kikuchi, Hi ...
Session ID: 11C-21
Published: 2010
Released on J-STAGE: July 17, 2014
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To overcome mechanical problems associated with the downsizing of theinterconnect bumps for flip-chip bonding, we have proposed a method of"Chemical Flip-chip Bonding" by employing chemical deposition. In thisstudy the correlation between bridge phenomenon and diffusion of thereaction products generated from surfaces of facing pads was experimentallydemonstrated using the original test chips with various pad-to-padconfigurations. The results also confirmed that this method is effectivefor long pad-to-pad connection with the distance of more than 50um.
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Yasuyuki Takanashi, Kenichi Ikeda, Shunsuke Kanetsuki, Shunji Araki, S ...
Session ID: 12A-01
Published: 2010
Released on J-STAGE: July 17, 2014
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Koji Motomura, Seiichi Yoshinaga, Yoshiyuki Wada, Tadahiko Sakai, Shoj ...
Session ID: 12A-02
Published: 2010
Released on J-STAGE: July 17, 2014
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Masaru Morita, Nobuyuki Hayashi, Teru Nakanishi, Katsusada Motoyoshi, ...
Session ID: 12A-03
Published: 2010
Released on J-STAGE: July 17, 2014
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Kenji Fukuzono, Masateru Koide, Manabu Watanabe
Session ID: 12A-04
Published: 2010
Released on J-STAGE: July 17, 2014
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Hiroshi Yamaguchi
Session ID: 12A-05
Published: 2010
Released on J-STAGE: July 17, 2014
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The expectations of SiC power devices are increasing in the field of power electronics. SiC power devices have many excellent characteristics compared to those of Si power devices, however, high level packaging technology are required in order to make full use of SiC devices. From this viewpoint, the expectations of packaging and wiring technology are pointed out.
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Shengde Zhang, Masao Sakane
Session ID: 12A-06
Published: 2010
Released on J-STAGE: July 17, 2014
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Takeshi Terasaki, Hisashi Tanie, Nobuhiko Chiwata, Motoki Wakano, Masa ...
Session ID: 12A-07
Published: 2010
Released on J-STAGE: July 17, 2014
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Kenji Tanaka
Session ID: 12A-08
Published: 2010
Released on J-STAGE: July 17, 2014
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Yuji Hirai, Hirotaka Nakamichi, Hiroshi Yabu, Yasutaka Matsuo, Kunihar ...
Session ID: 12A-09
Published: 2010
Released on J-STAGE: July 17, 2014
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Tomoaki Hirano, Hiroshi Nishikawa, Tadashi Takemoto, Nobuto Terada
Session ID: 12A-10
Published: 2010
Released on J-STAGE: July 17, 2014
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Eiichi Ide, Toshiaki Morita, yuji Kawauchi
Session ID: 12A-11
Published: 2010
Released on J-STAGE: July 17, 2014
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