Strength and fracture behavior of hot-pressed silicon nitride were studied in vacuum at high temperatures in three-point bending. Two kinds of silicon nitride were compared; SN-3 containing Mg, Al and Fe and HP (N) containing Al, Ti, Fe and Y. Furthermore surface flaws of controlled size and shape were produced in the specimens with a Vickers hardness indenter and the specimens were annealed at high temperatures in vacuum, in order to know the effect of the annealing on the room temperature strength in air of the specimens.
The results obtained were as follows:
(1) The annealing precracked specimens led the increase of the room temperature strength due to the relaxation of residual stress at crack at lower temperature and due to the evaporation-condensation of the material at higher temperature.
(2) The fracture surface of both SN-3 and HP(N) showed that crack transgranularly propagated at room temperature whether the specimens were precracked or not and whether they were annealed or not.
(3) Both specimens showed the decrease of strength at high temperature which coincided with that for the the beginning of slow crack growth. The slow crack growth occurred intergranularly and caused the decrease of the strength at high temperatures.
(4) The slow crack growth occurred above about 1000°C for SN-3 and about 1200°C for HP(N) not only in uncracked but also in precracked specimen. The difference of the nature of glassy phase or additives in both specimens may account for the difference of the beginning temperatrue of slow crack growth. Slow crack growth occurred in the bending at 1400°C in air as well.
(5) The critical stress intensity factor,
KIC, was obtained using a fracture mechanics formula for semielliptical surface flaws in bending: 450kg/cm
3/2 for SN-3 and 575kg/cm
3/2 for HP(N) at room temperature. At high temperatrue
KIC apparently increased when using the size of crack propagated by slow crack growth.
View full abstract