To reveal grain-size dependency and mechanism of creep of 1050 aluminum at low temperatures, creep tests were performed for the samples with grain sizes (
d) of 1.0–47 µm at 233–473K. Dislocation creep rate-controlled by non-diffusion process was observed at low temperatures, i.e.,
T<400K and 280K for coarse (CG) and ultrafine grained (UFG) specimens, respectively. The former showed creep at more than 0.2% proof stress, whereas the latter did it at less than that stress. Creep behavior of UFG aluminum was similar to ambient-temperature creep of hexagonal close-packed metals because apparent activation energy was about 30 kJ/mol. Although grain-size exponent was small, i.e.
p=0–0.3, in CG and UFG regions, transient region was observed at
d=1.7–10 µm and creep rate decreased of about one order. At high temperatures, CG and UFG aluminum showed conventional dislocation creep rate-controlled by dislocation-core diffusion.
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