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Volume 13 (1999)
- Issue 4 Pages 240-
- Issue 3 Pages 156-
- Issue 1 Pages 7-
Volume 13, Issue 1
Displaying 1-3 of 3 articles from this issue
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Effect of Thawing ConditionSeiji Yamada, Hiroshi Watanabe, Masahide Sugiyama, Takao Hiraiwa1999 Volume 13 Issue 1 Pages 7-12
Published: January 31, 1999
Released on J-STAGE: July 21, 2009
JOURNAL FREE ACCESSFrozen dough method is expected to improve the productivity in baking industry. However, there is a few reports that quantitatively analyzed the operational technique. The freezing damage of bread dough in the process of thawing is generally thought to occur because gluten network is destroyed by growth of ice crystals. The object of present study is to analyze the thawing process of bread dough by numerical method using the thermophysical properties measured previously by the authors. By considering the frozen ratio of the bread dough which depends on the temperature, results of the numerical calculation about the temperature change of the internal part of dough were approximate to the measured ones. The numerical simulation and results of baking test showed that the quality of bread was affected by the passage time of temperature zone of maximum ice crystal formation, tzi.View full abstractDownload PDF (1023K) -
Toshinobu Soma, Hiroko Kagaya, Satoru Nito, Mayumi Sato1999 Volume 13 Issue 1 Pages 13-16
Published: January 31, 1999
Released on J-STAGE: July 21, 2009
JOURNAL FREE ACCESSThe lattice dynamics and thermal properties of α-phase Al-Li alloy by solid-solutioning under pressure are studied using our previous microscopic electronic theory. The phonon frequencies of the band and local modes and the lattice specific heat at constant volume are presented theoretically for the Al1-xLix system. The band and local mode frequencies increase with the solubility of Li, and the specific heat decreases except at low temperatures. The Debye temperature for the AI1-xLix system is estimated from the specific heat at low temperatures and from the average elastic velocity. The Debye temperature decreases as Li content increases.View full abstractDownload PDF (197K) -
Heng Wang, Naofumi Yamada, Masahiro Okaji1999 Volume 13 Issue 1 Pages 17-22
Published: January 31, 1999
Released on J-STAGE: July 21, 2009
JOURNAL FREE ACCESSThe linear thermal expansion coefficients (LTEC) of silica glasses produced by the Nippon Glass lnc. Ltd. have been measured in the temperature range 0 ∼50°C using an interferometric dilatometer. The measurement system consists of a double-path optical heterodyne interferometer and a compact vaccum thermal bath controlled by a thermoelectric transducer. Before measuring the silica glass specimens, the reliability checks of the dilatometer were perfomed on silicon and fused silica SRM 739. The resultant estimated maximum uncertainty of the measured LTECs is about±2×10-8K-1. The measurement results indicated that, around room temperature (0∼50°C), only a factor of CI-rich content in silica glass affects the thermal expansion characteristics of the silica glass reducing slightly its absolute values, nevertheless the differences in the LTECs for all of the investigated specimens are sufficiently small within 4×10-8K-1View full abstractDownload PDF (1340K)
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